Inventor · disambiguated record
Takumi Ohkabe
Also filed as: OHKABE TAKUMI
3 granted patents·2 citations·filing 2016–2021
53Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0187US11612966B2Ag alloy bonding wire for semiconductor deviceNIPPON STEEL CHEMICAL & MAT CO LTD·Filed 2020·Granted Mar 28, 2023·2 cites·8 claims
- 0269US12412864B2Bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2021·Granted Sep 9, 2025·0 cites·7 claims
- 0351US11342299B2Bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2016·Granted May 24, 2022·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →