Assignee
NIPPON MICROMETAL CORP
JP·34 granted patents·15 pending applications·32 citations·filing 2013–2025
Top patents by PatentIndex Score
49 records- 0189US10137534B2Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2015·Granted Nov 27, 2018·5 cites·8 claims
- 0289US9887172B2Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2015·Granted Feb 6, 2018·6 cites·9 claims
- 0389US9773748B2Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2015·Granted Sep 26, 2017·5 cites·7 claims
- 0488US11721660B2Bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2022·Granted Aug 8, 2023·1 cites·13 claims
- 0587US11929343B2Bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2022·Granted Mar 12, 2024·1 cites·13 claims
- 0686US12090578B2Al bonding wireNIPPON MICROMETAL CORP·Filed 2020·Granted Sep 17, 2024·2 cites·2 claims
- 0785US10610976B2Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2017·Granted Apr 7, 2020·1 cites·22 claims
- 0884US11373934B2Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2017·Granted Jun 28, 2022·4 cites·13 claims
- 0975US12300658B2Copper alloy bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2022·Granted May 13, 2025·0 cites·3 claims
- 1075US2026097454A1Copper alloy bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2025·Application pending·0 cites
- 1172US9543266B2Bonding wire for semiconductor device use and method of production of sameNIPPON MICROMETAL CORP·Filed 2015·Granted Jan 10, 2017·2 cites·5 claims
- 1271US10737356B2Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2016·Granted Aug 11, 2020·1 cites·9 claims
- 1371US10414002B2Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2016·Granted Sep 17, 2019·1 cites·10 claims
- 1469US12412864B2Bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2021·Granted Sep 9, 2025·0 cites·7 claims
- 1569US2023387066A1Bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2023·Application pending·0 cites
- 1668US2024290745A1Bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2023·Application pending·0 cites
- 1766US10468370B2Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2015·Granted Nov 5, 2019·1 cites·7 claims
- 1866US9059003B2Power semiconductor device, method of manufacturing the device and bonding wireNIPPON MICROMETAL CORP·Filed 2013·Granted Jun 16, 2015·2 cites·24 claims
- 1964US10672733B2Cu alloy core bonding wire with Pd coating for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2019·Granted Jun 2, 2020·0 cites·20 claims
- 2063US2024297142A1Bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2022·Application pending·0 cites
- 2160US12581982B2Bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2021·Granted Mar 17, 2026·0 cites·13 claims
- 2260US10497663B2Cu alloy core bonding wire with Pd coating for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2019·Granted Dec 3, 2019·0 cites·21 claims
- 2359US12290883B2Bonding wireNIPPON MICROMETAL CORP·Filed 2023·Granted May 6, 2025·0 cites·16 claims
- 2458US2020013748A1Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2019·Application pending·0 cites
- 2557US12532767B2Al bonding wireNIPPON MICROMETAL CORP·Filed 2020·Granted Jan 20, 2026·0 cites·5 claims
- 2657US12334467B2Copper bonding wireNIPPON MICROMETAL CORP·Filed 2021·Granted Jun 17, 2025·0 cites·7 claims
- 2755US12388044B2Al bonding wireNIPPON MICROMETAL CORP·Filed 2020·Granted Aug 12, 2025·0 cites·4 claims
- 2855US12132025B2Bonding wireNIPPON MICROMETAL CORP·Filed 2020·Granted Oct 29, 2024·0 cites·4 claims
- 2955US10121758B2Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2017·Granted Nov 6, 2018·0 cites·9 claims
- 3054US12463172B2AG alloy bonding wire for semiconductor devices and semiconductor deviceNIPPON MICROMETAL CORP·Filed 2021·Granted Nov 4, 2025·0 cites·8 claims
- 3154US12325901B2AI wiring materialNIPPON MICROMETAL CORP·Filed 2020·Granted Jun 10, 2025·0 cites·8 claims
- 3254US10236272B2Cu alloy core bonding wire with Pd coating for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2015·Granted Mar 19, 2019·0 cites·10 claims
- 3352US2024290744A1Bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2022·Application pending·0 cites
- 3451US11342299B2Bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2016·Granted May 24, 2022·0 cites·8 claims
- 3551US2024290743A1Bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2022·Application pending·0 cites
- 3651US2020312808A1Copper alloy bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2017·Application pending·0 cites
- 3749US12463171B2Copper bonding wire for semiconductor devices and semiconductor deviceNIPPON MICROMETAL CORP·Filed 2020·Granted Nov 4, 2025·0 cites·5 claims
- 3848US2024105668A1Ai wiring materialNIPPON MICROMETAL CORP·Filed 2022·Application pending·0 cites
- 3945US10032741B2Bonding wire for semiconductor deviceNIPPON MICROMETAL CORP·Filed 2015·Granted Jul 24, 2018·0 cites·8 claims
- 4045US2023299037A1Al WIRING MATERIALNIPPON MICROMETAL CORP·Filed 2021·Application pending·0 cites
- 4145US2024071978A1Al BONDING WIRE FOR SEMICONDUCTOR DEVICESNIPPON MICROMETAL CORP·Filed 2022·Application pending·0 cites
- 4245US2024110262A1Ai wiring materialNIPPON MICROMETAL CORP·Filed 2022·Application pending·0 cites
- 4345US2023402422A1Ag ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICENIPPON MICROMETAL CORP·Filed 2021·Application pending·0 cites
- 4445US2024312946A1Ai bonding wire for semiconductor devicesNIPPON MICROMETAL CORP·Filed 2022·Application pending·0 cites
- 4544US10121764B2Method for forming ball in bonding wireNIPPON MICROMETAL CORP·Filed 2016·Granted Nov 6, 2018·0 cites·11 claims
- 4643US2023302584A1Al WIRING MATERIALNIPPON MICROMETAL CORP·Filed 2021·Application pending·0 cites
- 4740US11101234B2Cu pillar cylindrical preform for semiconductor connectionNIPPON MICROMETAL CORP·Filed 2015·Granted Aug 24, 2021·0 cites·10 claims
- 4840US9536854B2Bonding wire for semiconductor device use and method of production of sameNIPPON MICROMETAL CORP·Filed 2015·Granted Jan 3, 2017·0 cites·5 claims
- 4938US9434027B2Bonding wire and method for manufacturing sameNIPPON MICROMETAL CORP·Filed 2014·Granted Sep 6, 2016·0 cites·8 claims
Join the waitlist — get patent alerts
Get an alert when NIPPON MICROMETAL CORP files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →