Inventor · disambiguated record
Takeshi Saikawa
Also filed as: SAIKAWA TAKESHI
7 granted patents·5 pending applications·82 citations·filing 2000–2010
85Inventor score
Files withRENESAS TECH CORP6FUJIWARA TSUYOSHI2HITACHI ULSI SYS CO LTD1HITACHI ULSI SYSTEMS C O LTD1SATO HIDENORI1
Top patents by PatentIndex Score
12 records- 0193US7208391B2Method of manufacturing a semiconductor integrated circuit device that includes forming an isolation trench around active regions and filling the trench with two insulating filmsRENESAS TECH CORP·Filed 2005·Granted Apr 24, 2007·19 cites·15 claims
- 0291US7074691B2Method of manufacturing a semiconductor integrated circuit device that includes forming dummy patterns in an isolation region prior to filling with insulating materialHITACHI ULSI SYSTEMS C O LTD·Filed 2005·Granted Jul 11, 2006·20 cites·12 claims
- 0387US6693008B1Method of manufacturing a semiconductor integrated circuit device and a semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2000·Granted Feb 17, 2004·29 cites·9 claims
- 0478US8183616B2Semiconductor device, RF-IC and manufacturing method of the sameFUJIWARA TSUYOSHI·Filed 2010·Granted May 22, 2012·5 cites·10 claims
- 0578US7060589B2Method for manufacturing a semiconductor integrated circuit device that includes covering the bottom of an isolation trench with spin-on glass and etching back the spin-on glass to a predetermined depthHITACHI ULSI SYS CO LTD·Filed 2005·Granted Jun 13, 2006·4 cites·13 claims
- 0651US6767782B2Manufacturing method of semiconductor deviceRENESAS TECH CORP·Filed 2002·Granted Jul 27, 2004·5 cites·18 claims
- 0751US2010013568A1Semiconductor device, rf-ic and manufacturing method of the sameRENESAS TECH CORP·Filed 2009·Application pending·0 cites
- 0844US2006289917A1Semiconductor device, RF-IC and manufacturing method of the sameFUJIWARA TSUYOSHI·Filed 2006·Application pending·0 cites
- 0943US2004106292A1Method of manufacturing a semiconductor integrated circuit device and a semiconductor integrated circuit deviceFiled 2003·Application pending·0 cites
- 1042US2007114631A1Method of manufacturing a semiconductor integrated circuit device and a semiconductor integrated circuit deviceSATO HIDENORI·Filed 2007·Application pending·0 cites
- 1141US2004195611A1Semiconductor integrated circuit device and manufacturing method thereofRENESAS TECH CORP·Filed 2004·Application pending·0 cites
- 1238US6746913B2Method of manufacturing semiconductor integrated circuit device comprising a memory cell and a capacitorRENESAS TECH CORP·Filed 2002·Granted Jun 8, 2004·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →