Inventor · disambiguated record
Alois Tieber
Also filed as: TIEBER ALOIS
6 granted patents·159 citations·filing 1998–2002
86Inventor score
Technology areasH10P
Top patents by PatentIndex Score
6 records- 0177US6688300B2Techniques for dicing substrates during integrated circuit fabricationINTERCON TECHNOLOGIES INC·Filed 2001·Granted Feb 10, 2004·30 cites·15 claims
- 0273US6187654B1Techniques for maintaining alignment of cut dies during substrate dicingINTERCON TOOLS INC·Filed 1998·Granted Feb 13, 2001·38 cites·22 claims
- 0369US6165232AMethod and apparatus for securely holding a substrate during dicingTOWA CORP·Filed 1998·Granted Dec 26, 2000·46 cites·22 claims
- 0463US6325059B1Techniques for dicing substrates during integrated circuit fabricationINTERCON TOOLS INC·Filed 1999·Granted Dec 4, 2001·32 cites·63 claims
- 0561US6448156B1Techniques for maintaining alignment of cut dies during substrate dicingINTERCON TOOLS INC·Filed 2000·Granted Sep 10, 2002·7 cites·33 claims
- 0656US6638791B2Techniques for maintaining alignment of cut dies during substrate dicingINTERCON TECHNOLOGY INC·Filed 2002·Granted Oct 28, 2003·6 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →