Assignee
INTERCON TOOLS INC
US·3 granted patents·77 citations·filing 1998–2000
Top patents by PatentIndex Score
3 records- 0173US6187654B1Techniques for maintaining alignment of cut dies during substrate dicingINTERCON TOOLS INC·Filed 1998·Granted Feb 13, 2001·38 cites·22 claims
- 0263US6325059B1Techniques for dicing substrates during integrated circuit fabricationINTERCON TOOLS INC·Filed 1999·Granted Dec 4, 2001·32 cites·63 claims
- 0361US6448156B1Techniques for maintaining alignment of cut dies during substrate dicingINTERCON TOOLS INC·Filed 2000·Granted Sep 10, 2002·7 cites·33 claims
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