Inventor · disambiguated record
Hiroya Ishizuka
Also filed as: ISHIZUKA HIROYA
7 granted patents·5 pending applications·18 citations·filing 2003–2015
78Inventor score
Top patents by PatentIndex Score
12 records- 0180US8198540B2Power element mounting substrate, method of manufacturing the same, power element mounting unit, method of manufacturing the same, and power moduleKUROMITSU YOSHIROU·Filed 2007·Granted Jun 12, 2012·10 cites·15 claims
- 0269US9079264B2Ceramic substrate, method of manufacturing ceramic substrate, and method of manufacturing power module substrateMITSUBISHI MATERIALS CORP·Filed 2013·Granted Jul 14, 2015·2 cites·10 claims
- 0367US9237682B2Power module substrate with heat sink, and method for producing power module substrate with heat sinkMITSUBISHI MATERIALS CORP·Filed 2013·Granted Jan 12, 2016·2 cites·4 claims
- 0466US8044500B2Power module substrate, method for manufacturing power module substrate, and power moduleMITSUBISHI MATERIALS CORP·Filed 2007·Granted Oct 25, 2011·3 cites·4 claims
- 0556US8637777B2Power module substrate having heatsink, method for manufacturing the same, power module having heatsink, and power module substrateHAYASHI HIROMASA·Filed 2009·Granted Jan 28, 2014·1 cites·12 claims
- 0656US2010192841A1Reinforcing method of silica glass substance and reinforced silica glass crucibleJAPAN SUPER QUARTZ CORP·Filed 2010·Application pending·0 cites
- 0753US2008078207A1Reinforcing method of silica glass substance and reinforced silica glass crucibleJAPAN SUPER QUARTZ CORP·Filed 2007·Application pending·0 cites
- 0851US2010258233A1Ceramic substrate, method of manufacturing ceramic substrate, and method of manufacturing power module substrateMITSUBISHI MATERIALS CORP·Filed 2008·Application pending·0 cites
- 0941US10057993B2Manufacturing method of power-module substrateMITSUBISHI MATERIALS CORP·Filed 2013·Granted Aug 21, 2018·0 cites·17 claims
- 1041US2004112274A1Reinforcing process of silica glass substance and reinforced silica glass crucibleJAPAN SUPER QUARTZ CORP·Filed 2003·Application pending·0 cites
- 1141US2009229864A1Insulating circuit board and insulating circuit board having cooling sinkMITSUBISHI MATERIALS CORP·Filed 2006·Application pending·0 cites
- 1235US10037837B2Resistor and method for manufacturing resistorMITSUBISHI MATERIALS CORP·Filed 2015·Granted Jul 31, 2018·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →