Inventor · disambiguated record
Jae Hun Ku
Also filed as: KU JAE HUN
29 granted patents·1 pending application·1,141 citations·filing 1999–2014
97Inventor score
Files withAMKOR TECHNOLOGY INC12ST ASSEMBLY TEST SERVICES LTD7STATS CHIPPAC LTD3CHOI WON KYOUNG2SUTHIWONGSUNTHORN NATHAPONG2
Top patents by PatentIndex Score
30 records- 0197US9224647B2Semiconductor device and method of forming TSV interposer with semiconductor die and build-up interconnect structure on opposing surfaces of the interposerKOO JUN MO·Filed 2011·Granted Dec 29, 2015·109 cites·14 claims
- 0297US6858919B2Semiconductor packageAMKOR TECHNOLOGY INC·Filed 2001·Granted Feb 22, 2005·130 cites·16 claims
- 0397US6448633B1Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulantAMKOR TECHNOLOGY INC·Filed 1999·Granted Sep 10, 2002·258 cites·4 claims
- 0496US6646339B1Thin and heat radiant semiconductor package and method for manufacturingAMKOR TECHNOLOGY INC·Filed 2000·Granted Nov 11, 2003·111 cites·12 claims
- 0595US6759737B2Semiconductor package including stacked chips with aligned input/output padsAMKOR TECHNOLOGY INC·Filed 2001·Granted Jul 6, 2004·105 cites·24 claims
- 0695US6677663B1End grid array semiconductor packageAMKOR TECHNOLOGY INC·Filed 2000·Granted Jan 13, 2004·100 cites·5 claims
- 0793US8659162B2Semiconductor device having an interconnect structure with TSV using encapsulant for structural supportSUTHIWONGSUNTHORN NATHAPONG·Filed 2011·Granted Feb 25, 2014·19 cites·25 claims
- 0893US8067308B2Semiconductor device and method of forming an interconnect structure with TSV using encapsulant for structural supportSUTHIWONGSUNTHORN NATHAPONG·Filed 2009·Granted Nov 29, 2011·28 cites·27 claims
- 0993US8035204B2Large die package structures and fabrication method thereforST ASSEMBLY TEST SERVICES LTD·Filed 2010·Granted Oct 11, 2011·13 cites·12 claims
- 1092US6953988B2Semiconductor packageAMKOR TECHNOLOGY INC·Filed 2004·Granted Oct 11, 2005·60 cites·16 claims
- 1190US7700404B2Large die package structures and fabrication method thereforST ASSEMBLY TEST SERVICES LTD·Filed 2006·Granted Apr 20, 2010·16 cites·16 claims
- 1289US8742591B2Semiconductor device and method of forming insulating layer in notches around conductive TSV for stress reliefCHOI WON KYOUNG·Filed 2011·Granted Jun 3, 2014·10 cites·22 claims
- 1385US7339258B2Dual row leadframe and fabrication methodST ASSEMBLY TEST SERVICES LTD·Filed 2006·Granted Mar 4, 2008·11 cites·10 claims
- 1484US7129569B2Large die package structures and fabrication method thereforST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Oct 31, 2006·28 cites·16 claims
- 1584US7042068B2Leadframe and semiconductor package made using the leadframeAMKOR TECHNOLOGY INC·Filed 2001·Granted May 9, 2006·32 cites·18 claims
- 1682US9054083B2Semiconductor device and method of making TSV interconnect structures using encapsulant for structural supportSTATS CHIPPAC LTD·Filed 2013·Granted Jun 9, 2015·4 cites·25 claims
- 1782US6825062B2Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulantAMKOR TECHNOLOGY INC·Filed 2002·Granted Nov 30, 2004·26 cites·16 claims
- 1881US7060536B2Dual row leadframe and fabrication methodST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted Jun 13, 2006·26 cites·9 claims
- 1979US8410585B2Leadframe and semiconductor package made using the leadframeAHN BYUNG HOON·Filed 2006·Granted Apr 2, 2013·9 cites·20 claims
- 2078US7564122B2Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulantAMKOR TECHNOLOGY INC·Filed 2006·Granted Jul 21, 2009·6 cites·19 claims
- 2172US7057280B2Leadframe having lead locks to secure leads to encapsulantAMKOR TECHNOLOGY INC·Filed 2003·Granted Jun 6, 2006·14 cites·18 claims
- 2271US8399306B2Integrated circuit packaging system with transparent encapsulation and method of manufacture thereofKOO JUNMO·Filed 2011·Granted Mar 19, 2013·5 cites·18 claims
- 2369US7217599B2Integrated circuit package with leadframe locked encapsulation and method of manufacture thereforST ASSEMBLY TEST SERVICES LTD·Filed 2004·Granted May 15, 2007·13 cites·9 claims
- 2465US7413933B2Integrated circuit package with leadframe locked encapsulation and method of manufacture thereforST ASSEMBLY TEST SERVICES LTD·Filed 2007·Granted Aug 19, 2008·2 cites·20 claims
- 2554US9601462B2Semiconductor device and method of forming UBM structure on back surface of TSV semiconductor waferSTATS CHIPPAC LTD·Filed 2014·Granted Mar 21, 2017·0 cites·22 claims
- 2653US9362210B2Leadframe and semiconductor package made using the leadframeAMKOR TECHNOLOGY INC·Filed 2013·Granted Jun 7, 2016·0 cites·20 claims
- 2752US9837336B2Semiconductor device and method of forming insulating layer in notches around conductive TSV for stress reliefSTATS CHIPPAC LTD·Filed 2014·Granted Dec 5, 2017·0 cites·22 claims
- 2851US6616436B1Apparatus for manufacturing semiconductor packagesAMKOR TECHNOLOGY INC·Filed 2000·Granted Sep 9, 2003·6 cites·10 claims
- 2949US8809191B2Semiconductor device and method of forming UBM structure on back surface of TSV semiconductor waferCHOI WON KYOUNG·Filed 2011·Granted Aug 19, 2014·0 cites·27 claims
- 3040US2004061217A1Thin and heat radiant semiconductor package and method for manufacturingFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →