Inventor · disambiguated record
Andrew J. Brown
Also filed as: BROWN ANDREW · BROWN ANDREW J · BROWN ANDREW J W · BROWN ANDREW JAMES
54 granted patents·16 pending applications·399 citations·filing 1976–2023
98Inventor score
Files withINTEL CORP39R H ASSOCIATES LTD4BROWN ANDREW JAMES GUY3UNIV PITTSBURGH COMMONWEALTH SYS HIGHER EDUCATION3ACULIGHT CORP2
Top patents by PatentIndex Score
70 records- 0197US7199924B1Apparatus and method for spectral-beam combining of high-power fiber lasersACULIGHT CORP·Filed 2006·Granted Apr 3, 2007·155 cites·23 claims
- 0295US7233442B1Method and apparatus for spectral-beam combining of high-power fiber lasersACULIGHT CORP·Filed 2006·Granted Jun 19, 2007·53 cites·34 claims
- 0394US8472763B1Spectral beam combination of laser beamsLIU ANPING·Filed 2011·Granted Jun 25, 2013·17 cites·20 claims
- 0493US9375678B2Metal-organic framework supported on porous polymerNAIR SANKAR·Filed 2013·Granted Jun 28, 2016·22 cites·34 claims
- 0593US7535631B2Method and apparatus for spectral-beam combining of fiber-amplified laser beams using high-efficiency dielectric diffractive gratingsLOCKHEED CORP·Filed 2007·Granted May 19, 2009·33 cites·33 claims
- 0689US9060273B2Authentication server and methods for granting tokens comprising location dataBROWN ANDREW JAMES GUY·Filed 2012·Granted Jun 16, 2015·15 cites·33 claims
- 0788US9275162B2Pre-caching web content for a mobile deviceBROWN ANDREW JAMES GUY·Filed 2011·Granted Mar 1, 2016·11 cites·5 claims
- 0885US11981512B2Substrate support system for a conveyor printerINCA DIGITAL PRINTERS LTD·Filed 2022·Granted May 14, 2024·2 cites·20 claims
- 0984US10700021B2Coreless organic packages with embedded die and magnetic inductor structuresINTEL CORP·Filed 2018·Granted Jun 30, 2020·3 cites·11 claims
- 1083US11552008B2Asymmetric cored integrated circuit package supportsINTEL CORP·Filed 2018·Granted Jan 10, 2023·3 cites·24 claims
- 1182US8668764B2MOF nanocrystalsBROWN ANDREW·Filed 2012·Granted Mar 11, 2014·7 cites·27 claims
- 1280US12494443B2Substrate integrated thin film capacitors using amorphous high-k dielectricsINTEL CORP·Filed 2023·Granted Dec 9, 2025·0 cites·26 claims
- 1377US11804455B1Substrate integrated thin film capacitors using amorphous high-k dielectricsINTEL CORP·Filed 2022·Granted Oct 31, 2023·0 cites·25 claims
- 1477US11251113B2Methods of embedding magnetic structures in substratesINTEL CORP·Filed 2017·Granted Feb 15, 2022·2 cites·16 claims
- 1577US11189409B2Electronic substrates having embedded dielectric magnetic material to form inductorsINTEL CORP·Filed 2017·Granted Nov 30, 2021·2 cites·16 claims
- 1672US11881463B2Coreless organic packages with embedded die and magnetic inductor structuresINTEL CORP·Filed 2021·Granted Jan 23, 2024·0 cites·13 claims
- 1772US11737208B2Microelectronic assemblies having conductive structures with different thicknessesINTEL CORP·Filed 2019·Granted Aug 22, 2023·1 cites·13 claims
- 1871US8578027B2Communications system providing server load balancing based upon load and separation metrics and related methodsBROWN ANDREW JAMES GUY·Filed 2010·Granted Nov 5, 2013·4 cites·17 claims
- 1970US12288744B2Microelectronic assemblies having conductive structures with different thicknesses on a core substrateINTEL CORP·Filed 2022·Granted Apr 29, 2025·0 cites·11 claims
- 2070US11862552B2Methods of embedding magnetic structures in substratesINTEL CORP·Filed 2022·Granted Jan 2, 2024·0 cites·7 claims
- 2170US11335632B2Magnetic inductor structures for package devicesINTEL CORP·Filed 2017·Granted May 17, 2022·1 cites·15 claims
- 2269US2023345621A1Microelectronic assemblies having conductive structures with different thicknessesINTEL CORP·Filed 2023·Application pending·0 cites
- 2368US2023369192A1Dual trace thickness for single layer routingINTEL CORP·Filed 2023·Application pending·0 cites
- 2467US11495555B2Magnetic bilayer structure for a cored or coreless semiconductor packageINTEL CORP·Filed 2018·Granted Nov 8, 2022·1 cites·13 claims
- 2567US11205626B2Coreless organic packages with embedded die and magnetic inductor structuresINTEL CORP·Filed 2020·Granted Dec 21, 2021·0 cites·30 claims
- 2665US11317955B2Magnesium enhanced/induced bone formationUNIV OF PITTSBURGH—OF THE COMMONWEALTH SYSTEM OF HIGHER EDUCATION·Filed 2015·Granted May 3, 2022·2 cites·15 claims
- 2764US11552010B2Dielectric for high density substrate interconnectsINTEL CORP·Filed 2017·Granted Jan 10, 2023·0 cites·25 claims
- 2864US2022230951A1Magnetic inductor structures for package devicesINTEL CORP·Filed 2022·Application pending·0 cites
- 2962US2025090278A1Magnesium mesh with features designed to bioabsorb progressively to improve dental bone regenerationUNIV PITTSBURGH COMMONWEALTH SYS HIGHER EDUCATION·Filed 2022·Application pending·0 cites
- 3061US2022013265A1Electronic substrates having embedded dielectric magnetic material to form inductorsINTEL CORP·Filed 2021·Application pending·0 cites
- 3160US12246532B2Vacuum aperture valve arrayAGFA NV·Filed 2022·Granted Mar 11, 2025·0 cites·14 claims
- 3259US11495552B2Substrate integrated thin film capacitors using amorphous high-k dielectricsINTEL CORP·Filed 2018·Granted Nov 8, 2022·0 cites·25 claims
- 3356US11830809B2Magnetic structures in integrated circuit package supportsINTEL CORP·Filed 2020·Granted Nov 28, 2023·0 cites·19 claims
- 3455US11670504B2Ultra-thin dielectric films using photo up-conversion for applications in substrate manufacturing and integrating passivesINTEL CORP·Filed 2019·Granted Jun 6, 2023·0 cites·23 claims
- 3555US11380609B2Microelectronic assemblies having conductive structures with different thicknesses on a core substrateINTEL CORP·Filed 2018·Granted Jul 5, 2022·0 cites·20 claims
- 3655US5551690ARacket handleR H ASSOCIATES LTD·Filed 1995·Granted Sep 3, 1996·26 cites·69 claims
- 3755US2023094767A1Degradable magnesium tenting device for faster surgeries and improved outcomes in vertical ridge augmentationUNIV PITTSBURGH COMMONWEALTH SYS HIGHER EDUCATION·Filed 2021·Application pending·0 cites
- 3853US11769719B2Dual trace thickness for single layer routingINTEL CORP·Filed 2018·Granted Sep 26, 2023·0 cites·8 claims
- 3952US11824013B2Package substrate with reduced interconnect stressINTEL CORP·Filed 2019·Granted Nov 21, 2023·0 cites·20 claims
- 4051US11444042B2Magnetic structures in integrated circuit packagesINTEL CORP·Filed 2018·Granted Sep 13, 2022·0 cites·18 claims
- 4151US10672859B2Embedded magnetic inductorINTEL CORP·Filed 2018·Granted Jun 2, 2020·0 cites·12 claims
- 4250US10692965B23D conductive ink printing method and inductor formed thereofINTEL CORP·Filed 2018·Granted Jun 23, 2020·0 cites·11 claims
- 4349US11622448B2Sandwich-molded cores for high-inductance architecturesINTEL CORP·Filed 2019·Granted Apr 4, 2023·0 cites·25 claims
- 4449US9898546B2Pre-caching web content for a mobile deviceBLACKBERRY LTD·Filed 2015·Granted Feb 20, 2018·0 cites·17 claims
- 4549US9687791B2Flow processing and characterization of metal-organic framework (MOF) membranes in hollow fiber and tubular modulesGEORGIA TECH RES INST·Filed 2014·Granted Jun 27, 2017·0 cites·28 claims
- 4649US8152414B2Device and method for suppressing vortex-induced vibrationsBROWN ANDREW JAMES·Filed 2008·Granted Apr 10, 2012·2 cites·29 claims
- 4747US11289263B2Electronic substrates having embedded magnetic material using photo-imagable dielectric layersINTEL CORP·Filed 2017·Granted Mar 29, 2022·0 cites·20 claims
- 4847US2020402720A1Embedded thin film capacitor with nanocube film and process for forming suchINTEL CORP·Filed 2019·Application pending·0 cites
- 4946US11705389B2Vias for package substratesINTEL CORP·Filed 2019·Granted Jul 18, 2023·0 cites·24 claims
- 5046US11610706B2Release layer-assisted selective embedding of magnetic material in cored and coreless organic substratesINTEL CORP·Filed 2018·Granted Mar 21, 2023·0 cites·12 claims
Showing the top 50 of 70 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →