Inventor · disambiguated record
Marlies Kleinfeld
Also filed as: KLEINFELD MARLIES
3 granted patents·8 pending applications·37 citations·filing 1997–2016
69Inventor score
Top patents by PatentIndex Score
11 records- 0179US7713859B2Tin-silver solder bumping in electronics manufactureENTHONE·Filed 2006·Granted May 11, 2010·12 cites·28 claims
- 0277US6821323B1Process for the non-galvanic tin plating of copper or copper alloysENTHONE·Filed 2000·Granted Nov 23, 2004·24 cites·50 claims
- 0344US2019085461A1Water soluble and air stable phosphaadamantanes as stabilizers for electroless metal depositionMACDERMID ENTHONE INC·Filed 2016·Application pending·0 cites
- 0442US2006260948A2Method for electrodeposition of bronzesENTHONE·Filed 2005·Application pending·0 cites
- 0541US2006049058A1Method for the electrolytic deposition of metalsENTHONE·Filed 2005·Application pending·0 cites
- 0640US2014158545A1Apparatus for electrochemical deposition of a metalSchäfer Stefan·Filed 2012·Application pending·0 cites
- 0739US2005034996A1Non-reactive coatings for inertizationFiled 2004·Application pending·0 cites
- 0839US2006137991A1Method for bronze galvanic coatingENTHONE·Filed 2003·Application pending·0 cites
- 0936US2008261071A1Preserving Solderability and Inhibiting Whisker Growth in Tin Surfaces of Electronic ComponentsXU CHEN·Filed 2005·Application pending·0 cites
- 1035US2005249969A1Preserving solderability and inhibiting whisker growth in tin surfaces of electronic componentsENTHONE·Filed 2004·Application pending·0 cites
- 1128US5981793ASlightly water-soluble metal salts, a process for the preparation thereof, and the use thereof as gloss additives in the electrolytic deposition of metalsBLASBERG OBERFLAECHENTECH·Filed 1997·Granted Nov 9, 1999·1 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →