Inventor · disambiguated record
Yousuke Hirota
Also filed as: HIROTA YOUSUKE
5 granted patents·2 pending applications·1 citations·filing 2011–2017
60Inventor score
Top patents by PatentIndex Score
7 records- 0160US10113028B2Epoxy resin, curable resin composition, cured product, semiconductor encapsulating material, semiconductor device, prepreg, circuit board, buildup film, buildup substrate, fiber-reinforced composite material and fiber-reinforced molded articleDAINIPPON INK & CHEMICALS·Filed 2015·Granted Oct 30, 2018·1 cites·13 claims
- 0243US11015019B2Epoxy resin, production method, epoxy resin composition and cured product of sameDAINIPPON INK & CHEMICALS·Filed 2017·Granted May 25, 2021·0 cites·2 claims
- 0341US8703845B2Curable resin composition, cured product thereof, phenolic resin, epoxy resin, and semiconductor sealing materialOGURA ICHIROU·Filed 2011·Granted Apr 22, 2014·0 cites·16 claims
- 0438US9580634B2Phenolic-hydroxyl-containing resin, epoxy resin, curable resin composition, substance obtained by curing same, and semiconductor sealantDAINIPPON INK & CHEMICALS·Filed 2013·Granted Feb 28, 2017·0 cites·18 claims
- 0534US10808085B2Phenol novolak resin, curable resin composition, and cured product thereofDAINIPPON INK & CHEMICALS·Filed 2017·Granted Oct 20, 2020·0 cites·20 claims
- 0633US2018346639A1Epoxy resin, method for producing the epoxy resin, curable resin composition, and cured product thereofDAINIPPON INK & CHEMICALS·Filed 2016·Application pending·0 cites
- 0732US2013184377A1Curable resin composition, cured product thereof, phenol resin, epoxy resin, and semiconductor encapsulating materialOGURA ICHIROU·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →