Assignee
OGURA ICHIROU
JP·4 granted patents·1 pending application·3 citations·filing 2006–2011
Top patents by PatentIndex Score
5 records- 0165US8084567B2Epoxy resin composition and cured article thereof, novel epoxy resin and production method thereof, and novel phenol resinOGURA ICHIROU·Filed 2009·Granted Dec 27, 2011·3 cites·3 claims
- 0251US8440781B2Epdxy resin composition and cured article thereof, semiconductor encapsulation material, novel phenol resin, and novel epdoxy resinOGURA ICHIROU·Filed 2009·Granted May 14, 2013·0 cites·8 claims
- 0345US8420749B2Epoxy resin composition and cured article thereof, semiconductor encapsulation material, novel phenol resin, and novel epoxy resinOGURA ICHIROU·Filed 2006·Granted Apr 16, 2013·0 cites·9 claims
- 0441US8703845B2Curable resin composition, cured product thereof, phenolic resin, epoxy resin, and semiconductor sealing materialOGURA ICHIROU·Filed 2011·Granted Apr 22, 2014·0 cites·16 claims
- 0532US2013184377A1Curable resin composition, cured product thereof, phenol resin, epoxy resin, and semiconductor encapsulating materialOGURA ICHIROU·Filed 2011·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →