Inventor · disambiguated record
Jens Paul
Also filed as: PAUL JENS
3 granted patents·21 citations·filing 2003–2013
65Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0189US8957524B2Pillar structure for use in packaging integrated circuit products and methods of making such a pillar structureGLOBALFOUNDRIES INC·Filed 2013·Granted Feb 17, 2015·15 cites·17 claims
- 0242US6791349B2Electrical component with a contact and method for forming a contact on a semiconductor materialINFINEON TECHNOLOGIES AG·Filed 2003·Granted Sep 14, 2004·5 cites·13 claims
- 0341US7180162B2Arrangement for reducing stress in substrate-based chip packagesINFINEON TECHNOLOGIES AG·Filed 2004·Granted Feb 20, 2007·1 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →