Inventor · disambiguated record
Ohsug Kim
Also filed as: KIM OHSUG
5 granted patents·31 citations·filing 2005–2009
78Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0178US8089166B2Integrated circuit package with top padKIM OHSUG·Filed 2006·Granted Jan 3, 2012·12 cites·20 claims
- 0277US7635913B2Stacked integrated circuit package-in-package systemSTATS CHIPPAC LTD·Filed 2006·Granted Dec 22, 2009·7 cites·30 claims
- 0372US7833840B2Integrated circuit package system with down-set die pad and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2006·Granted Nov 16, 2010·6 cites·20 claims
- 0469US8617924B2Stacked integrated circuit package-in-package system and method of manufacture thereofKIM OHSUG·Filed 2009·Granted Dec 31, 2013·4 cites·16 claims
- 0554US7968371B2Semiconductor package system with cavity substrateSTATS CHIPPAC LTD·Filed 2005·Granted Jun 28, 2011·2 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →