Inventor · disambiguated record
Hideyuki Katagi
Also filed as: KATAGI HIDEYUKI
13 granted patents·8 pending applications·14 citations·filing 2009–2024
85Inventor score
Files withHITACHI CHEMICAL CO LTD7SHOWA DENKO MATERIALS CO LTD5NISHIYAMA TOMOO3RESONAC CORP3KATAGI HIDEYUKI1
Top patents by PatentIndex Score
21 records- 0191US11208525B2Epoxy resin, epoxy resin composition, inorganic filler-containing epoxy resin composition, resin sheet, cured product, and epoxy compoundHITACHI CHEMICAL CO LTD·Filed 2019·Granted Dec 28, 2021·2 cites·12 claims
- 0291US10662279B2Epoxy resin composition, semi-cured epoxy resin composition, cured epoxy resin composition, molded article, and cured molded articleHITACHI CHEMICAL CO LTD·Filed 2016·Granted May 26, 2020·4 cites·18 claims
- 0385US10988585B2Resin sheet and cured product of resin sheetHITACHI CHEMICAL CO LTD·Filed 2016·Granted Apr 27, 2021·2 cites·10 claims
- 0482US12116451B2Epoxy resin, epoxy resin composition, epoxy resin cured product and composite materialSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Oct 15, 2024·1 cites·11 claims
- 0566US12049538B2Epoxy resin, epoxy resin composition, epoxy resin cured product and composite materialSHOWA DENKO MATERIALS CO LTD·Filed 2018·Granted Jul 30, 2024·0 cites·12 claims
- 0666US2018009979A1Resin composition, resin sheet, and cured resin material and method for producing the sameHITACHI CHEMICAL CO LTD·Filed 2017·Application pending·0 cites
- 0763US10934387B2Epoxy resin, epoxy resin composition, inorganic filler-containing epoxy resin composition, resin sheet, cured product, and epoxy compoundHITACHI CHEMICAL CO LTD·Filed 2015·Granted Mar 2, 2021·0 cites·5 claims
- 0861US2014283972A1Resin composition, resin sheet, and cured resin material and method for producing the sameHITACHI CHEMICAL CO LTD·Filed 2014·Application pending·0 cites
- 0960US9075307B2Photosensitive resin composition for protective film of printed wiring board for semiconductor packageKURAFUCHI KAZUHIKO·Filed 2009·Granted Jul 7, 2015·3 cites·9 claims
- 1059US11661475B2Epoxy resin, epoxy resin composition, epoxy resin cured product and composite materialSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted May 30, 2023·0 cites·9 claims
- 1159US11352562B2Epoxy resin, epoxy resin composition, epoxy resin cured product and composite materialSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Jun 7, 2022·0 cites·7 claims
- 1258US2025297129A1Photosensitive resin composition, photosensitive resin film, printed wiring board, and semiconductor packageRESONAC CORP·Filed 2024·Application pending·0 cites
- 1356US9349931B2Resin composition, resin sheet, cured resin sheet, resin sheet laminate, cured resin sheet laminate and method for producing same, semiconductor device and LED deviceNISHIYAMA TOMOO·Filed 2012·Granted May 24, 2016·2 cites·24 claims
- 1455US11919995B2Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite materialRESONAC CORP·Filed 2019·Granted Mar 5, 2024·0 cites·14 claims
- 1552US2024393686A1Photosensitive resin composition, photosensitive resin film, multilayered printed wiring board, semiconductor package, and method for producing multilayered printed wiring boardRESONAC CORP·Filed 2021·Application pending·0 cites
- 1648US11535700B2Epoxy polymer, epoxy resin, epoxy resin composition, resin sheet, b-stage sheet, cured product, c-stage sheet, metal foil with resin, metal substrate and method for manufacturingSHOWA DENKO MATERIALS CO LTD·Filed 2017·Granted Dec 27, 2022·0 cites·21 claims
- 1748US2012251830A1Resin composition, resin sheet, and cured resin material and method for producing the sameNISHIYAMA TOMOO·Filed 2010·Application pending·0 cites
- 1847US10941241B2Epoxy resin molding material, molded product, molded cured product, and method for producing molded cured productHITACHI CHEMICAL CO LTD·Filed 2016·Granted Mar 9, 2021·0 cites·19 claims
- 1935US2014248504A1Resin composition, resin sheet, cured resin sheet, resin-adhered metal foil and heat dissipation deviceSONG SHIHUI·Filed 2012·Application pending·0 cites
- 2031US2012244351A1Multilayer resin sheet and method for producing the same, method for producing cured multilayer resin sheet, and highly thermally conductive resin sheet laminate and method for producing the sameKATAGI HIDEYUKI·Filed 2010·Application pending·0 cites
- 2129US2013189514A1Multilayer resin sheet and process for production thereof, resin sheet laminate and process for production thereof, cured multilayer resin sheet, metal-foil-cladded multilayer resin sheet, and semiconductor deviceNISHIYAMA TOMOO·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →