Inventor · disambiguated record
Daewoo Son
Also filed as: SON DAEWOO
4 granted patents·24 citations·filing 2009–2016
74Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0189US8836149B2Hybrid substrates, semiconductor packages including the same and methods for fabricating semiconductor packagesSON DAEWOO·Filed 2011·Granted Sep 16, 2014·14 cites·10 claims
- 0280US9620494B2Hybrid substrates, semiconductor packages including the same and methods for fabricating semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Apr 11, 2017·3 cites·20 claims
- 0377US9460937B2Hybrid substrates, semiconductor packages including the same and methods for fabricating semiconductor packagesSON DAEWOO·Filed 2014·Granted Oct 4, 2016·4 cites·10 claims
- 0459US8198722B2Semiconductor packageCHO YOUNGSANG·Filed 2009·Granted Jun 12, 2012·3 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →