Assignee
SON DAEWOO
KR·2 granted patents·18 citations·filing 2011–2014
Top patents by PatentIndex Score
2 records- 0189US8836149B2Hybrid substrates, semiconductor packages including the same and methods for fabricating semiconductor packagesSON DAEWOO·Filed 2011·Granted Sep 16, 2014·14 cites·10 claims
- 0277US9460937B2Hybrid substrates, semiconductor packages including the same and methods for fabricating semiconductor packagesSON DAEWOO·Filed 2014·Granted Oct 4, 2016·4 cites·10 claims
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