Inventor · disambiguated record
Sri Chaitra Jyotsna Chavali
Also filed as: CHAVALI SRI CHAITRA · CHAVALI SRI CHAITRA J · CHAVALI SRI CHAITRA JYOTSNA
44 granted patents·14 pending applications·83 citations·filing 2015–2025
97Inventor score
Top patents by PatentIndex Score
58 records- 0197US10424530B1Electrical interconnections with improved compliance due to stress relaxation and method of makingINTEL CORP·Filed 2018·Granted Sep 24, 2019·28 cites·21 claims
- 0296US11664290B2Package with underfill containment barrierINTEL CORP·Filed 2021·Granted May 30, 2023·3 cites·20 claims
- 0394US2025391754A1Ultra-thin, hyper-density semiconductor packagesINTEL CORP·Filed 2025·Application pending·0 cites
- 0491US11430724B2Ultra-thin, hyper-density semiconductor packagesINTEL CORP·Filed 2017·Granted Aug 30, 2022·5 cites·24 claims
- 0590US10624213B1Asymmetric electronic substrate and method of manufactureINTEL CORP·Filed 2018·Granted Apr 14, 2020·5 cites·8 claims
- 0690US9837341B1Tin-zinc microbump structuresINTEL CORP·Filed 2016·Granted Dec 5, 2017·6 cites·17 claims
- 0789US11158558B2Package with underfill containment barrierINTEL CORP·Filed 2016·Granted Oct 26, 2021·5 cites·16 claims
- 0888US11387175B2Interposer package-on-package (PoP) with solder array thermal contactsINTEL CORP·Filed 2018·Granted Jul 12, 2022·6 cites·16 claims
- 0988US11355849B2Antenna package using ball attach array to connect antenna and base substratesINTEL CORP·Filed 2017·Granted Jun 7, 2022·4 cites·21 claims
- 1088US11107757B2Integrated circuit structures in package substratesINTEL CORP·Filed 2020·Granted Aug 31, 2021·2 cites·20 claims
- 1184US12476174B2Ultra-thin, hyper-density semiconductor packagesINTEL CORP·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
- 1284US12327773B2Package with underfill containment barrierINTEL CORP·Filed 2024·Granted Jun 10, 2025·0 cites·20 claims
- 1384US10685850B2High density organic interconnect structuresINTEL CORP·Filed 2016·Granted Jun 16, 2020·3 cites·11 claims
- 1484US9953959B1Metal protected fan-out cavityINTEL CORP·Filed 2017·Granted Apr 24, 2018·4 cites·8 claims
- 1584US2024355641A1High density organic interconnect structuresINTEL CORP·Filed 2024·Application pending·0 cites
- 1681US10672693B2Integrated circuit structures in package substratesINTEL CORP·Filed 2018·Granted Jun 2, 2020·2 cites·21 claims
- 1781US9865568B2Integrated circuit structures with recessed conductive contacts for package on packageINTEL CORP·Filed 2015·Granted Jan 9, 2018·3 cites·20 claims
- 1881US2025226583A1Antenna package using ball attach array to connect antenna and base substratesINTEL CORP·Filed 2025·Application pending·0 cites
- 1980US12062551B2High density organic interconnect structuresINTEL CORP·Filed 2023·Granted Aug 13, 2024·0 cites·20 claims
- 2080US11935805B2Package with underfill containment barrierINTEL CORP·Filed 2023·Granted Mar 19, 2024·0 cites·20 claims
- 2179US12406914B2Ultra-thin, hyper-density semiconductor packagesINTEL CORP·Filed 2022·Granted Sep 2, 2025·0 cites·20 claims
- 2277US11869842B2Scalable high speed high bandwidth IO signaling package architecture and method of makingINTEL CORP·Filed 2019·Granted Jan 9, 2024·2 cites·17 claims
- 2377US10658765B2Edge-firing antenna walls built into substrateINTEL CORP·Filed 2018·Granted May 19, 2020·2 cites·32 claims
- 2477US10424561B2Integrated circuit structures with recessed conductive contacts for package on packageINTEL CORP·Filed 2018·Granted Sep 24, 2019·2 cites·25 claims
- 2576US11870163B2Antenna package using ball attach array to connect antenna and base substratesINTEL CORP·Filed 2022·Granted Jan 9, 2024·0 cites·25 claims
- 2676US2025022814A1Package embedded magnetic inductor structures and manufacturing techniques for 5-50 mhz smps operationsINTEL CORP·Filed 2024·Application pending·0 cites
- 2776US2022344247A1Ultra-thin, hyper-density semiconductor packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 2875US11631595B2High density organic interconnect structuresINTEL CORP·Filed 2021·Granted Apr 18, 2023·0 cites·11 claims
- 2972US12132015B2Package embedded magnetic inductor structures and manufacturing techniques for 5-50 MHZ SMPS operationsINTEL CORP·Filed 2019·Granted Oct 29, 2024·1 cites·10 claims
- 3071US11804426B2Integrated circuit structures in package substratesINTEL CORP·Filed 2021·Granted Oct 31, 2023·0 cites·12 claims
- 3171US11195727B2High density organic interconnect structuresINTEL CORP·Filed 2020·Granted Dec 7, 2021·0 cites·18 claims
- 3269US2024088047A1Scalable high speed high bandwidth io signaling package architecture and method of makingINTEL CORP·Filed 2023·Application pending·0 cites
- 3366US10980129B2Asymmetric electronic substrate and method of manufactureINTEL CORP·Filed 2020·Granted Apr 13, 2021·0 cites·10 claims
- 3463US11664313B2Microelectronic device including fiber-containing build-up layersINTEL CORP·Filed 2021·Granted May 30, 2023·0 cites·17 claims
- 3557US2025364388A1Microelectronic assemblies including substrates with via clustering for high-speed signalingINTEL CORP·Filed 2024·Application pending·0 cites
- 3656US10903137B2Electrical interconnections with improved compliance due to stress relaxation and method of makingINTEL CORP·Filed 2019·Granted Jan 26, 2021·0 cites·20 claims
- 3756US2025311090A1Methods, systems, apparatus, and articles of manufacture to reduce crosstalk in integrated circuit packagesINTEL CORP·Filed 2024·Application pending·0 cites
- 3855US12334242B2Coreless electronic substrates having embedded inductorsINTEL CORP·Filed 2021·Granted Jun 17, 2025·0 cites·14 claims
- 3955US11004792B2Microelectronic device including fiber-containing build-up layersINTEL CORP·Filed 2018·Granted May 11, 2021·0 cites·18 claims
- 4055US10373900B2Tin-zinc microbump structures and method of making sameINTEL CORP·Filed 2017·Granted Aug 6, 2019·0 cites·8 claims
- 4152US2023317592A1Substrate with low-permittivity core and buildup layersINTEL CORP·Filed 2022·Application pending·0 cites
- 4251US9728500B2Integrated circuit surface layer with adhesion-functional groupINTEL CORP·Filed 2015·Granted Aug 8, 2017·0 cites·13 claims
- 4350US12261124B2Embedded die architecture and method of makingINTEL CORP·Filed 2019·Granted Mar 25, 2025·0 cites·22 claims
- 4449US11196165B2Low z-height, ultra-low dielectric constant air cavity based and multi-core/highly asymmetric antenna substrate architectures for electrical performance improvements in 5G mm-wave applicationsINTEL CORP·Filed 2018·Granted Dec 7, 2021·0 cites·25 claims
- 4549US10384431B2Methods for forming a substrate structure for an electrical component and an apparatus for applying pressure to an electrically insulating laminate located on a core substrateINTEL CORP·Filed 2017·Granted Aug 20, 2019·0 cites·24 claims
- 4649US2017301619A1Integrated circuit surface layer with adhesion-functional groupINTEL CORP·Filed 2017·Application pending·0 cites
- 4749US2024070366A1Adaptive trace width in multi-layer substrate packageINTEL CORP·Filed 2022·Application pending·0 cites
- 4848US12033930B2Selectively roughened copper architectures for low insertion loss conductive featuresINTEL CORP·Filed 2020·Granted Jul 9, 2024·0 cites·18 claims
- 4948US11764150B2Inductors for package substratesINTEL CORP·Filed 2019·Granted Sep 19, 2023·0 cites·18 claims
- 5048US11721632B2Hybrid core substrate architecture for high speed signaling and FLI/SLI reliability and its makingINTEL CORP·Filed 2019·Granted Aug 8, 2023·0 cites·25 claims
Showing the top 50 of 58 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →