Integrated circuit surface layer with adhesion-functional group

Abstract

Embodiments of the present disclosure describe an integrated circuit and associated fabrication techniques and configurations, which may include forming on at least one of a metal layer or a polymer layer of an integrated circuit die a surface layer that includes an adhesion-functional group, and applying to the surface layer a next layer to adhere to the surface layer with the adhesion-functional group. In embodiments wherein the at least one of the metal layer or the polymer layer is a polymer layer, forming the surface layer may include copolymerizing on the polymer layer a polar monomer that includes the adhesion-functional group. In embodiments wherein the at least one of the metal layer or the polymer layer is a metal layer, forming the surface layer may include forming on the metal layer a self-assembled monolayer that includes amine group terminations. Other embodiments may be described and/or claimed.

What is claimed is: 
     
         1 . An integrated circuit (IC), comprising:
 a die;   a polymer layer formed on a die; and   a surface layer comprising a polar monomer that is copolymerized on the polymer layer in response to exposure of a solution disposed on the polymer layer to light, wherein the solution includes a photoinitiator and a polar monomer with an adhesion-functional group, wherein the polymer layer is free from the adhesion-functional group.   
     
     
         2 . The IC of  claim 1  further comprising a next layer applied to the polymer surface layer with adhesion functional by the adhesion-functional group. 
     
     
         3 . The IC of  claim 2  wherein the adhesion-functional group includes an amine group. 
     
     
         4 . The IC of  claim 3 , wherein the next layer includes silica. 
     
     
         5 . The IC of  claim 2 , wherein the adhesion-functional group includes a cyano group. 
     
     
         6 . The IC of  claim 5 , wherein the next layer includes a metal. 
     
     
         7 . The IC of  claim 1 , wherein the adhesion-functional group includes a hydroxyl group. 
     
     
         8 . The IC of  claim 1 , wherein the next layer includes another polymer layer. 
     
     
         9 . The IC of  claim 1 , wherein the polar monomer further includes another adhesion-functional group. 
     
     
         10 . An integrated circuit (IC), comprising:
 a die with multiple layers that include a metal layer;   a surface layer disposed on the metal layer, wherein the surface layer comprises an adhesion-functional group and amine group terminations; and   a next layer disposed on the surface layer, wherein the next layer is adhered to the surface layer with the adhesion-functional group.   
     
     
         11 . The IC of  claim 10 , wherein the surface layer includes a self-assembled monolayer. 
     
     
         12 . The IC of  claim 11 , wherein the self-assembled monolayer is thiol-based. 
     
     
         13 . The IC of  claim 10 , wherein the next layer comprises a heat-treated dielectric layer.