Inventor · disambiguated record
Takahiko Kurosawa
Also filed as: KUROSAWA TAKAHIKO
17 granted patents·13 pending applications·299 citations·filing 1997–2014
94Inventor score
Top patents by PatentIndex Score
30 records- 0191US7528207B2Method for producing polymer, polymer, composition for forming insulating film, method for producing insulating film, and insulating filmJSR CORP·Filed 2006·Granted May 5, 2009·16 cites·5 claims
- 0284US6406794B1Film-forming compositionJSR CORP·Filed 2001·Granted Jun 18, 2002·32 cites·17 claims
- 0383US8980971B2Stereolithography resin compositions and three-dimensional objects made therefromDSM IP ASSETS BV·Filed 2013·Granted Mar 17, 2015·21 cites·20 claims
- 0483US8268403B2Method for forming organic silica film, organic silica film, wiring structure, semiconductor device, and composition for film formationAKIYAMA MASAHIRO·Filed 2005·Granted Sep 18, 2012·11 cites·20 claims
- 0583US6011123ACurable resin composition and cured productsJSR CORP·Filed 1997·Granted Jan 4, 2000·61 cites·12 claims
- 0682US6410151B1Composition for film formation, method of film formation, and insulating filmJSR CORP·Filed 2000·Granted Jun 25, 2002·30 cites·8 claims
- 0780US8404786B2Polymer and process for producing the same, composition for forming insulating film, and insulating film and method of forming the sameAKIYAMA MASAHIRO·Filed 2010·Granted Mar 26, 2013·5 cites·17 claims
- 0880US7875317B2Composition for forming insulating film, method for producing same, silica-based insulating film, and method for forming sameJSR CORP·Filed 2006·Granted Jan 25, 2011·7 cites·15 claims
- 0980US6410150B1Composition for film formation, method of film formation, and insulating filmJSR CORP·Filed 2000·Granted Jun 25, 2002·28 cites·10 claims
- 1075US6558747B2Method of forming insulating film and process for producing semiconductor deviceTOSHIBA KK·Filed 2001·Granted May 6, 2003·19 cites·20 claims
- 1174US7358317B2Polycarbosilane and method of producing the sameJSR CORP·Filed 2005·Granted Apr 15, 2008·2 cites·20 claims
- 1272US6313233B1Curable resin composition cured productsJSR CORP·Filed 1999·Granted Nov 6, 2001·35 cites·15 claims
- 1368US7556860B2Laminate and method of forming the same, insulating film, and semiconductor deviceJSR CORP·Filed 2006·Granted Jul 7, 2009·6 cites·13 claims
- 1465US7736748B2Insulating-film-forming composition, method of producing the same, silica-based insulating film, and method of forming the sameJSR CORP·Filed 2006·Granted Jun 15, 2010·2 cites·17 claims
- 1558US2014241687A1D1499 radiation curable resin compositionDSM IP ASSETS BV·Filed 2014·Application pending·0 cites
- 1656US2012321270A1D1499 radiation curable resin compositionIMAI HIROKAZU·Filed 2010·Application pending·0 cites
- 1756US2016326410A1Sealer for sealing covered-wireJSR CORP·Filed 2014·Application pending·0 cites
- 1854US6235101B1Composition for film formation and filmJSR CORP·Filed 1998·Granted May 22, 2001·20 cites·11 claims
- 1953US2012205135A1Radiation curable resin composition for wire coatingYAMAGUCHI HIROSHI·Filed 2010·Application pending·0 cites
- 2052US2012145432A1Radiation curable resin composition for wire coatingYAMAGUCHI HIROSHI·Filed 2010·Application pending·0 cites
- 2151US2010071928A1Radiation curable resin compositions for electric wire coatingsYAMAGUCHI HIROSHI·Filed 2008·Application pending·0 cites
- 2250US2007027287A1Polymer and process for producing the same, composition for forming insulating film, and insulating film and method of forming the sameJSR CORP·Filed 2006·Application pending·0 cites
- 2349US2007015892A1Method for producing polymer, polymer, composition for forming insulating film, method for producing insulating film, and insulating filmJSR CORP·Filed 2006·Application pending·0 cites
- 2447US2006134336A1Novel polycarbosilane and method of producing the same, film-forming composition, and film and method of forming the sameJSR CORP·Filed 2005·Application pending·0 cites
- 2544US7049220B2Method of forming cavity between multilayered wiringsJSR CORP·Filed 2003·Granted May 23, 2006·2 cites·7 claims
- 2643US7005248B2Method of forming cavity between multilayered wiringsJSR CORP·Filed 2003·Granted Feb 28, 2006·2 cites·18 claims
- 2741US2008038527A1Method for Forming Organic Silica Film, Organic Silica Film, Wiring Structure, Semiconductor Device, and Composition for Film FormationJSR CORP·Filed 2005·Application pending·0 cites
- 2839US2010227941A1Stereolithography resin compositions and three-dimensional objects made therefromDSM IP ASSETS BV·Filed 2008·Application pending·0 cites
- 2937US2013199818A1Radiation curable resin composition for electrical wireUCHIDA HIROFUMI·Filed 2011·Application pending·0 cites
- 3037US2012055693A1Kit for preparing water-sealing material for electrical wire, water-sealing material for electrical wire, water-sealing member, water-sealed electrical wire, and water-sealing methodYAMAGUCHI HIROSHI·Filed 2010·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →