US2010227941A1PendingUtilityA1

Stereolithography resin compositions and three-dimensional objects made therefrom

Assignee: DSM IP ASSETS BVPriority: Mar 20, 2007Filed: Mar 19, 2008Published: Sep 9, 2010
Est. expiryMar 20, 2027(~0.7 yrs left)· nominal 20-yr term from priority
B33Y 70/00G03F 7/038G03F 7/00G03F 7/0037G03F 7/027Y10T428/24893B33Y 10/00
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Claims

Abstract

A photocurable resin composition for three-dimensional photofabrication operations, including stereolithography, comprising (A) a cationically polymerizable compound having two or more bisphenol structures and one or more hydroxyl groups, (B) a cationically polymerizable compound other than the component (A), (C) a cationic photoinitiator, (D) a radically polymerizable compound, (E) a radical photoinitiator, and (F) multilayer polymer particles having a core and a shell layer, the shell layer containing functional group-modified rubber polymer particles having at least one reactive functional group.

Claims

exact text as granted — not AI-modified
1 . A photocurable resin composition for three-dimensional photofabrication comprising
 (A) a cationically polymerizable compound having two or more bisphenol structures and one or more hydroxyl groups;   (B) a cationically polymerizable compound other than the component (A);   (C) a cationic photoinitiator;   (D) a radically polymerizable compound;   (E) a radical photoinitiator; and   (F) multilayer polymer particles having a core and a shell layer, the shell layer containing functional group-modified rubber polymer particles having at least one reactive functional group.   
   
   
       2 . The photocurable resin composition according to  claim 1 , wherein the component (A) is an epoxy compound of the following general formula (1), 
     
       
         
         
             
             
         
       
       wherein R 1  represents —C(CH 3 ) 2 —, —CH 2 —, or —SO 2 —, k represents an integer from 1 to 4, and n represents an integer from 1 to 10. 
     
   
   
       3 . The photocurable resin composition according to  claim 1 , wherein said at least one reactive functional group is selected from the group consisting of an epoxy group, a hydroxyl group, a (meth)acryloyl group, and an oxetanyl group. 
   
   
       4 . The photocurable resin composition according to  claim 3 , wherein said at least one reactive functional group is an epoxy group; wherein said epoxy group is an alicyclic epoxy group. 
   
   
       5 . The photocurable resin composition according to  claim 1 , wherein the multilayer polymer particles (F) have an average particle diameter of from about 10 to about 700 nm. 
   
   
       6 . The photocurable resin composition according to  claim 1 , wherein the multilayer polymer particles (F) have an average particle diameter of from about 100 to about 400 nm. 
   
   
       7 . The photocurable resin composition according to  claim 1 , wherein the component (B) contains a compound having an oxetane structure. 
   
   
       8 . The photocurable resin composition according to  claim 1 , wherein the component (B) contains a compound having a bisphenol structure. 
   
   
       9 . A photocurable resin composition for three-dimensional photofabrication comprising:
 (A) from about 3 to about 40% by mass of a cationically polymerizable compound having two or more bisphenol structures and one or more hydroxyl groups;   (B) from about 20 to about 85% by mass of a cationically polymerizable compound other than the component (A);   (C) from about 0.1 to about 10% by mass of a cationic photoinitiator;   (D) from about 3 to about 45% by mass of a radically polymerizable compound; and   (E) from about 0.01 to about 10 by mass of a radical photoinitiator;   
     wherein component (A) is an epoxy compound of the following general formula (1), 
     
       
         
         
             
             
         
       
     
     wherein R 1  represents —C(CH 3 ) 2 —, —CH 2 —, or —SO 2 —, k represents an integer from 1 to 4, and n represents an integer from 1 to 10. 
   
   
       10 . The photocurable resin composition according to  claim 8 , wherein said composition further comprises from about 1 to about 35% by mass of multilayer polymer particles (F). 
   
   
       11 . The photocurable resin composition according to  claim 1 , wherein said composition further comprises a polyether polyol (G). 
   
   
       12 . A three-dimensional object made of a cured product of the photocurable resin composition according to  claim 1 . 
   
   
       13 . A process for making a three dimensional article comprising the steps of
 (1) coating a thin layer of a composition onto a surface;   (2) exposing said thin layer imagewise to actinic radiation to form an imaged cross-section, wherein the radiation is of sufficient intensity and time to cause substantial curing of the thin layer in the exposed areas;   (3) coating a thin layer of the composition onto the previously exposed imaged cross-section;   (4) exposing said thin layer from step (3) imagewise to actinic radiation to form an additional imaged cross-section, wherein the radiation is of sufficient intensity and time to cause substantial curing of the thin layer in the exposed areas and to cause adhesion to the previously exposed imaged cross-section;   (5) repeating steps (3) and (4) a sufficient number of times in order to build up the three-dimensional article, wherein said composition is defined according to  claim 1 .

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