Inventor · disambiguated record
Kyung-Lae Jang
Also filed as: JANG KYUNG-LAE
7 granted patents·2 pending applications·95 citations·filing 2005–2010
83Inventor score
Top patents by PatentIndex Score
9 records- 0197US7327038B2Semiconductor device packageSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Feb 5, 2008·69 cites·24 claims
- 0279US7330084B2Printed circuit board having a bond wire shield structure for a signal transmission lineSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Feb 12, 2008·9 cites·32 claims
- 0378US7374969B2Semiconductor package with conductive molding compound and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted May 20, 2008·9 cites·39 claims
- 0467US7372139B2Semiconductor chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted May 13, 2008·3 cites·12 claims
- 0562US7663221B2Package circuit board with a reduced number of pins and package including a package circuit board with a reduced number of pins and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Feb 16, 2010·2 cites·22 claims
- 0660US7652367B2Semiconductor package on package having plug-socket type wire connection between packagesSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jan 26, 2010·3 cites·7 claims
- 0749US2005242426A1Semiconductor package having a first conductive bump and a second conductive bump and methods for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Application pending·0 cites
- 0843US2010117451A1Package circuit board with a reduced number of pins and package including a package circuit board with a reduced number of pins and methods of manufacturing the sameJANG KYUNG-LAE·Filed 2010·Application pending·0 cites
- 0940US7566954B2Bonding configurations for lead-frame-based and substrate-based semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jul 28, 2009·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →