Package circuit board with a reduced number of pins and package including a package circuit board with a reduced number of pins and methods of manufacturing the same

Abstract

A package circuit board having a reduced package size. The package circuit board may include a semiconductor substrate in place of a printed circuit board. The package circuit board may further include a microelectronic chip mounted on the semiconductor substrate, the microelectronic chip having at least one of active and passive elements formed on the semiconductor substrate semiconductor substrate.

1 . A method of reducing a number of input/output (I/O) ports on a semiconductor substrate, comprising:
 receiving a first voltage at a semiconductor substrate, the first voltage being the only power supply voltage received by the semiconductor substrate;   converting the first voltage into at least one other power supply voltage; and   supplying the at least one other supply voltage to a microelectronic chip.   
     
     
         2 . A method of forming a package circuit board, comprising:
 forming a semiconductor integrated circuit on a first surface of a semiconductor substrate, the semiconductor integrated circuit configured to process at least one signal associated with a microelectronic chip; and   forming a plurality of signal input/output (I/O) ports on a second surface of the semiconductor substrate, the second surface not including the first surface, at least a portion of the second surface being electrically connected to the semiconductor integrated substrate.   
     
     
         3 . A method of fabricating a package circuit board, comprising:
 patterning an integrated circuit on a first surface of a substrate, the integrated circuit including at least one passive element that includes at least one of a capacitor, an inductor, a resistor, and a pass filter;   forming a plurality of signal input/output (I/O) ports on a second surface of the substrate, the second surface not including the first surface, at least a portion of the second surface being electrically connected to the integrated circuit; and   mounting a microelectronic chip on the integrated circuit, wherein the integrated circuit is configured to process at least one signal associated with the microelectronic chip.   
     
     
         4 . A method of fabricating a package circuit board comprising:
 forming a plurality of input/output (I/O) ports including a plurality of power supply pins on one side of a substrate, the substrate being configured to receive a single power supply voltage from the plurality of power supply pins and to convert the single power supply voltage into at least one other power supply voltage; and   mounting a microelectronic chip on a portion of the substrate, the microelectronic chip including at least one device requiring the at least one other power supply voltage, wherein the substrate includes a voltage converter for converting the single power supply voltage into the at least one other required power supply voltage.