Inventor · disambiguated record
Benjamin A. Bonner
Also filed as: BONNER BENJAMIN A
11 granted patents·9 pending applications·220 citations·filing 1998–2023
92Inventor score
Top patents by PatentIndex Score
20 records- 0196US9153486B2CVD based metal/semiconductor OHMIC contact for high volume manufacturing applicationsLAM RES CORP·Filed 2013·Granted Oct 6, 2015·31 cites·25 claims
- 0288US6855043B1Carrier head with a modified flexible membraneAPPLIED MATERIALS INC·Filed 2000·Granted Feb 15, 2005·33 cites·4 claims
- 0386US7601050B2Polishing apparatus with grooved subpadAPPLIED MATERIALS INC·Filed 2007·Granted Oct 13, 2009·11 cites·14 claims
- 0486US6561381B1Closed loop control over delivery of liquid material to semiconductor processing toolAPPLIED MATERIALS INC·Filed 2000·Granted May 13, 2003·34 cites·8 claims
- 0581US7179159B2Materials for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2005·Granted Feb 20, 2007·8 cites·17 claims
- 0673US6834777B2Closed loop control over delivery of liquid material to semiconductor processing toolAPPLIED MATERIALS INC·Filed 2003·Granted Dec 28, 2004·14 cites·8 claims
- 0773US6811470B2Methods and compositions for chemical mechanical polishing shallow trench isolation substratesAPPLIED MATERIALS INC·Filed 2002·Granted Nov 2, 2004·20 cites·58 claims
- 0873US6220941B1Method of post CMP defect stability improvementAPPLIED MATERIALS INC·Filed 1998·Granted Apr 24, 2001·35 cites·21 claims
- 0971US7429210B2Materials for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2007·Granted Sep 30, 2008·3 cites·18 claims
- 1062US6361405B1Utility wafer for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2000·Granted Mar 26, 2002·10 cites·15 claims
- 1160US6251001B1Substrate polishing with reduced contaminationAPPLIED MATERIALS INC·Filed 1999·Granted Jun 26, 2001·21 cites·12 claims
- 1257US2025246434A1Metal silicide contact formationLAM RES CORP·Filed 2023·Application pending·0 cites
- 1357US2014237905A1Method of forming polishing sheetAPPLIED MATERIALS INC·Filed 2014·Application pending·0 cites
- 1451US2010112919A1Monolithic linear polishing sheetAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
- 1549US2007218693A1High selectivity slurry compositions for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2007·Application pending·0 cites
- 1646US2009088051A1Leader and trailer for linear polishing sheetAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
- 1746US2006097219A1High selectivity slurry compositions for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2005·Application pending·0 cites
- 1843US2010120335A1Partial Contact Wafer Retaining Ring ApparatusNOVELLUS SYSTEMS INC·Filed 2008·Application pending·0 cites
- 1942US2007212976A1Smart polishing media assembly for planarizing substratesAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 2034US2002100743A1Multi-step polish process to control uniformity when using a selective slurry on patterned wafersFiled 2000·Application pending·0 cites
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