Inventor · disambiguated record
Jonathon G. Greenwood
Also filed as: GREENWOOD JONATHON · GREENWOOD JONATHON G · GREENWOOD JONATHON GERRIT
22 granted patents·6 pending applications·740 citations·filing 1994–2024
96Inventor score
Files withMICRON TECHNOLOGY INC12MOTOROLA INC7AMKOR TECHNOLOGY INC5GREENWOOD JONATHON G3SILVESTRI PAUL1
Top patents by PatentIndex Score
28 records- 0197US8344514B2Semiconductor device structures and electronic devices including same hybrid conductive viasMICRON TECHNOLOGY INC·Filed 2011·Granted Jan 1, 2013·34 cites·20 claims
- 0294US8872310B2Semiconductor device structures and electronic devices including hybrid conductive vias, and methods of fabricationMICRON TECHNOLOGY INC·Filed 2012·Granted Oct 28, 2014·13 cites·34 claims
- 0394US6338985B1Making chip size semiconductor packagesAMKOR TECHNOLOGY INC·Filed 2000·Granted Jan 15, 2002·100 cites·28 claims
- 0493US6593545B1Laser defined pads for flip chip on leadframe package fabrication methodAMKOR TECHNOLOGY INC·Filed 2001·Granted Jul 15, 2003·60 cites·19 claims
- 0591US6577012B1Laser defined pads for flip chip on leadframe packageAMKOR TECHNOLOGY INC·Filed 2001·Granted Jun 10, 2003·67 cites·21 claims
- 0691US5431332AMethod and apparatus for solder sphere placement using an air knifeMOTOROLA INC·Filed 1994·Granted Jul 11, 1995·213 cites·23 claims
- 0788US7939449B2Methods of forming hybrid conductive vias including small dimension active surface ends and larger dimension back side endsMICRON TECHNOLOGY INC·Filed 2008·Granted May 10, 2011·12 cites·11 claims
- 0888US6807218B1Laser module and optical subassemblyAMKOR TECHNOLOGY INC·Filed 2002·Granted Oct 19, 2004·26 cites·29 claims
- 0986US5444303AWire bond pad arrangement having improved pad densityMOTOROLA INC·Filed 1994·Granted Aug 22, 1995·90 cites·9 claims
- 1081US2024186465A1Packaged leds with phosphor films, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1180US11081625B2Packaged LEDs with phosphor films, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2017·Granted Aug 3, 2021·2 cites·18 claims
- 1275US11901494B2Packaged LEDs with phosphor films, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Feb 13, 2024·0 cites·20 claims
- 1375US8598612B2Light emitting diode thermally enhanced cavity package and method of manufactureGREENWOOD JONATHON G·Filed 2010·Granted Dec 3, 2013·4 cites·26 claims
- 1475US8441020B2Light emitting diode wafer-level package with self-aligning featuresGREENWOOD JONATHON G·Filed 2010·Granted May 14, 2013·4 cites·30 claims
- 1572US5647123AMethod for improving distribution of underfill between a flip chip die and a circuit boardMOTOROLA INC·Filed 1995·Granted Jul 15, 1997·48 cites·6 claims
- 1668US9735136B2Method for embedding silicon die into a stacked packageSILVESTRI PAUL·Filed 2009·Granted Aug 15, 2017·3 cites·19 claims
- 1765US2021202461A1Method for embedding silicon die into a stacked packageMICRON TECHNOLOGY INC·Filed 2021·Application pending·0 cites
- 1862US5598967AMethod and structure for attaching a circuit module to a circuit boardMOTOROLA INC·Filed 1995·Granted Feb 4, 1997·21 cites·10 claims
- 1959US6596212B1Method and apparatus for increasing thickness of molded body on semiconductor packageAMKOR TECHNOLOGY INC·Filed 2000·Granted Jul 22, 2003·9 cites·10 claims
- 2056US5679498AMethod for producing high density multi-layer integrated circuit carriersMOTOROLA INC·Filed 1995·Granted Oct 21, 1997·22 cites·12 claims
- 2154US8936953B2Light emitting diode thermally enhanced cavity package and method of manufactureMICRON TECHNOLOGY INC·Filed 2013·Granted Jan 20, 2015·0 cites·19 claims
- 2253US8878205B2Light emitting diode wafer-level package with self-aligning featuresMICRON TECHNOLOGY INC·Filed 2013·Granted Nov 4, 2014·0 cites·21 claims
- 2352US2017309607A1Method for embedding silicon die into a stacked packageMICRON TECHNOLOGY INC·Filed 2017·Application pending·0 cites
- 2447US2011309393A1Packaged leds with phosphor films, and associated systems and methodsGREENWOOD JONATHON G·Filed 2010·Application pending·0 cites
- 2546US2016031707A1Microelectronic devices and methods for manufacturing microelectronic devicesMICRON TECHNOLOGY INC·Filed 2015·Application pending·0 cites
- 2646US2007045807A1Microelectronic devices and methods for manufacturing microelectronic devicesMICRON TECHNOLOGY INC·Filed 2005·Application pending·0 cites
- 2736US5625224AMethod and apparatus for an integrated circuit chip carrier having improved mounting pad densityMOTOROLA INC·Filed 1994·Granted Apr 29, 1997·8 cites·5 claims
- 2834US5716760AMethod for plating a substrate to eliminate the use of a solder maskMOTOROLA INC·Filed 1997·Granted Feb 10, 1998·4 cites·30 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →