Inventor · disambiguated record
Kum-Weng Loo
Also filed as: LOO KUM-WENG
8 granted patents·1 pending application·38 citations·filing 2003–2010
83Inventor score
Files withST MICROELECTRONICS ASIA6LOO KUM WENG1ST MICROELECTRONICS RES & DEV1ST MICROELECTRONICS SRL1
Top patents by PatentIndex Score
9 records- 0181US8013438B2Semiconductor package with a stiffening member supporting a thermal heat spreaderST MICROELECTRONICS ASIA·Filed 2009·Granted Sep 6, 2011·10 cites·26 claims
- 0272US7880132B2Cap including a housing and optically transparent member to protect a camera module lensST MICROELECTRONICS RES & DEV·Filed 2007·Granted Feb 1, 2011·5 cites·29 claims
- 0371US8338943B2Semiconductor package with thermal heat spreaderLOO KUM WENG·Filed 2010·Granted Dec 25, 2012·5 cites·26 claims
- 0460US7061697B2Method for fixing a lens of an optic group with respect to an optical sensor inside an electronic device able to acquire images and corresponding deviceST MICROELECTRONICS SRL·Filed 2004·Granted Jun 13, 2006·10 cites·39 claims
- 0555US7056765B2Semiconductor device package and method of manufactureST MICROELECTRONICS ASIA·Filed 2003·Granted Jun 6, 2006·8 cites·18 claims
- 0647US7745945B2Semiconductor package with position memberST MICROELECTRONICS ASIA·Filed 2006·Granted Jun 29, 2010·0 cites·31 claims
- 0745US7919361B2Semiconductor package with position memberST MICROELECTRONICS ASIA·Filed 2010·Granted Apr 5, 2011·0 cites·22 claims
- 0841US2011006411A1Simplified multichip packaging and package designST MICROELECTRONICS ASIA·Filed 2010·Application pending·0 cites
- 0938US7816182B2Simplified multichip packaging and package designST MICROELECTRONICS ASIA·Filed 2004·Granted Oct 19, 2010·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →