Simplified multichip packaging and package design

Abstract

A multichip integrated circuit apparatus includes first and second integrated circuit die mounted on opposite sides of a leadframe die paddle, with at least one of the integrated circuit die extending further toward the leads than does the die paddle. With this arrangement, the active circuit areas of both integrated circuit die can face in the same direction, and can be wire bonded to the same surfaces of the leads. This avoids wire bonding complications that are often encountered in multichip integrated circuit package designs.

1 . An integrated circuit apparatus, comprising:
 a leadframe including a first set of leads, a second set of leads and a die paddle disposed between said first and second sets of leads;   a first integrated circuit die mounted on a first side of said die paddle;   a second integrated circuit die mounted on a second side of said die paddle which faces generally oppositely of said first side of said die paddle; and   one of said first and second integrated circuit die extending further toward both of said first and second sets of leads than does said die paddle.   
     
     
         2 . The apparatus of  claim 1 , wherein the other of said first and second integrated circuit die extends further toward both of said first and second sets of leads than does said die paddle. 
     
     
         3 . The apparatus of  claim 1 , wherein each of said leads has first and second generally oppositely facing surfaces, all of said first surfaces facing generally in a first direction and all of said second surfaces facing generally in a second direction that is generally opposite said first direction, and including a first plurality of electrically conductive wires, each said wire of said first plurality having one end bonded to said first surface of one of said leads and having another end bonded to said first integrated circuit die, and a second plurality of electrically conductive wires, each said wire of said second plurality having one end bonded to said first surface of one of said leads and having another end bonded to said second integrated circuit die. 
     
     
         4 . The apparatus of  claim 3 , wherein said first integrated circuit die has an active circuit area which faces said first side of said die paddle. 
     
     
         5 . The apparatus of  claim 1 , wherein said first integrated circuit die has an active circuit area which faces said first side of said die paddle, and including a plurality of electrically conductive wires, each said wire having one end bonded to one of said leads and having another end bonded to said first integrated circuit die. 
     
     
         6 . The apparatus of  claim 1 , wherein said leads are approximately coplanar with said die paddle. 
     
     
         7 . The apparatus of  claim 1 , wherein said die paddle is a split die paddle. 
     
     
         8 . The apparatus of  claim 1 , including a third integrated circuit die mounted on a spacer that is mounted on said first integrated circuit die and is interposed between said first integrated circuit die and said third integrated circuit die. 
     
     
         9 . The apparatus of  claim 8 , wherein each of said leads has a first portion that is approximately coplanar with said first integrated circuit die, and a second portion that extends from said first portion at an angle directed toward one of said second and third integrated circuit die. 
     
     
         10 . An integrated circuit apparatus, comprising:
 a leadframe including a first set of leads, a second set of leads and a die paddle disposed between said first and second sets of leads;   a first integrated circuit die mounted on a first side of said die paddle;   a second integrated circuit die mounted on a second side of said die paddle which faces generally oppositely of said first side of said die paddle;   each of said leads having first and second generally oppositely facing surfaces, all of said first surfaces facing generally in a first direction and all of said second surfaces facing generally in a second direction that is generally opposite said first direction;   a first plurality of electrically conductive wires, each said wire of said first plurality having one end bonded to said first surface of one of said leads and having another end bonded to said first die; and   a second plurality of electrically conductive wires, each said wire of said second plurality having one end bonded to said first surface of one of said leads and having another end bonded to said second die.   
     
     
         11 . The apparatus of  claim 10 , wherein said leads are approximately coplanar with said die paddle. 
     
     
         12 . The apparatus of  claim 10 , wherein said die paddle is a split die paddle. 
     
     
         13 . The apparatus of  claim 10 , including a third integrated circuit die mounted on a spacer that is mounted on said first integrated circuit die and is interposed between said first integrated circuit die and said third integrated circuit die. 
     
     
         14 . The apparatus of  claim 13 , wherein each of said leads has a first portion that is approximately coplanar with said first integrated circuit die, and a second portion that extends from said first portion at an angle directed toward one of said second and third integrated circuit die. 
     
     
         15 . An integrated circuit apparatus, comprising:
 a leadframe including a first set of leads, a second set of leads and a die paddle disposed between said first and second sets of leads;   a first integrated circuit die mounted on a first side of said die paddle;   a second integrated circuit die mounted on a second side of said die paddle which faces generally oppositely of said first side of said die paddle;   said first integrated circuit die having an active circuit area which faces said first side of said die paddle; and   a plurality of electrically conductive wires, each said wire having one end bonded to one of said leads and having another end bonded to said first integrated circuit die.   
     
     
         16 . The apparatus of  claim 15 , wherein said leads are approximately coplanar with said die paddle. 
     
     
         17 . The apparatus of  claim 15 , wherein said die paddle is a split die paddle. 
     
     
         18 . The apparatus of  claim 15 , including a third integrated circuit die mounted on a spacer that is mounted on said first integrated circuit die and is interposed between said first integrated circuit die and said third integrated circuit die. 
     
     
         19 . The apparatus of  claim 18 , wherein each of said leads has a first portion that is approximately coplanar with said first integrated circuit die, and a second portion that extends from said first portion at an angle directed toward one of said second and third integrated circuit die. 
     
     
         20 .- 22 . (canceled)