Inventor · disambiguated record
Sudarshan Rangaraj
Also filed as: RANGARAJ SUDARSHAN · RANGARAJ SUDARSHAN V
5 granted patents·3 pending applications·9 citations·filing 2004–2008
69Inventor score
Top patents by PatentIndex Score
8 records- 0172US7585693B2Method of forming a microelectronic package using control of die and substrate differential expansions and microelectronic package formed according to the methodINTEL CORP·Filed 2006·Granted Sep 8, 2009·6 cites·18 claims
- 0252US7659192B2Methods of forming stepped bumps and structures formed therebyINTEL CORP·Filed 2006·Granted Feb 9, 2010·1 cites·12 claims
- 0346US7719109B2Embedded capacitors for reducing package crackingINTEL CORP·Filed 2006·Granted May 18, 2010·0 cites·12 claims
- 0446US2009065931A1Packaged integrated circuit and method of forming thereofINTEL CORP·Filed 2007·Application pending·0 cites
- 0542US7692307B2Compliant structure for an electronic device, method of manufacturing same, and system containing sameINTEL CORP·Filed 2006·Granted Apr 6, 2010·0 cites·12 claims
- 0642US7288472B2Method and system for performing die attach using a flameINTEL CORP·Filed 2004·Granted Oct 30, 2007·2 cites·39 claims
- 0740US2008157392A1Methods of forming stepped bumps and structures formed therebyYEOHI ANDREW·Filed 2008·Application pending·0 cites
- 0838US2008001282A1Microelectronic assembly having a periphery seal around a thermal interface materialMODI MITUL·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →