Inventor · disambiguated record
Jason M. Gamba
Also filed as: GAMBA JASON · GAMBA JASON M · GAMBA JASON MICHAEL
13 granted patents·27 pending applications·27 citations·filing 2011–2025
88Inventor score
Top patents by PatentIndex Score
40 records- 0197US11521931B2Microelectronic structures including bridgesINTEL CORP·Filed 2020·Granted Dec 6, 2022·7 cites·18 claims
- 0297US11302643B2Microelectronic component having molded regions with through-mold viasINTEL CORP·Filed 2020·Granted Apr 12, 2022·5 cites·19 claims
- 0396US12176292B2Microelectronic component having molded regions with through-mold viasINTEL CORP·Filed 2023·Granted Dec 24, 2024·2 cites·20 claims
- 0495US11817390B2Microelectronic component having molded regions with through-mold viasINTEL CORP·Filed 2022·Granted Nov 14, 2023·2 cites·20 claims
- 0588US11233009B2Embedded multi-die interconnect bridge having a molded region with through-mold viasINTEL CORP·Filed 2020·Granted Jan 25, 2022·2 cites·15 claims
- 0687US2025070030A1Microelectronic component having molded regions with through-mold viasINTEL CORP·Filed 2024·Application pending·0 cites
- 0783US2025226323A1Microelectronic component having molded regions with through-mold viasINTEL CORP·Filed 2025·Application pending·0 cites
- 0877US11640942B2Microelectronic component having molded regions with through-mold viasINTEL CORP·Filed 2022·Granted May 2, 2023·0 cites·20 claims
- 0975US10847471B2Dielectric filler material in conductive material that functions as fiducial for an electronic deviceINTEL CORP·Filed 2018·Granted Nov 24, 2020·2 cites·7 claims
- 1075US8597577B2Swept-frequency semiconductor laser coupled to microfabricated biomolecular sensor and methods related theretoFLAGAN RICHARD C·Filed 2011·Granted Dec 3, 2013·7 cites·9 claims
- 1174US2025125307A1Microelectronic assemblies including interconnects with different solder materialsINTEL CORP·Filed 2024·Application pending·0 cites
- 1270US11688692B2Embedded multi-die interconnect bridge having a substrate with conductive pathways and a molded material region with through-mold viasINTEL CORP·Filed 2021·Granted Jun 27, 2023·0 cites·17 claims
- 1366US12412868B2Microelectronic assemblies including interconnects with different solder materialsINTEL CORP·Filed 2021·Granted Sep 9, 2025·0 cites·20 claims
- 1463US11527484B2Dielectric filler material in conductive material that functions as fiducial for an electronic deviceINTEL CORP·Filed 2020·Granted Dec 13, 2022·0 cites·17 claims
- 1561US2025022786A1Methods and apparatus for edge protected glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 1661US2024355758A1Methods and apparatus to reduce stress between sockets and associated integrated circuit packages having glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 1760US2025309522A1Antenna structures in glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 1858US2025125201A1Package substrates with components included in cavities of glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 1958US2025126814A1Package substrates with components included in cavities of glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 2058US2025125202A1Package substrates with components included in cavities of glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 2158US2025120102A1Package substrates with components included in cavities of glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 2258US2025112100A1Die embedded in glass layer with two-side connectivityINTEL CORP·Filed 2023·Application pending·0 cites
- 2357US2025293122A1Multi-die assemblies with glass support structuresINTEL CORP·Filed 2024·Application pending·0 cites
- 2456US2025183180A1Direct bonding for embedded bridges with viasINTEL CORP·Filed 2023·Application pending·0 cites
- 2555US2024290723A1Protection against electromigration within a layer of an integrated circuitINTEL CORP·Filed 2023·Application pending·0 cites
- 2654US2024332155A1Substrates with a glass core and glass buildup layersINTEL CORP·Filed 2023·Application pending·0 cites
- 2753US2025112136A1Glass core protection using peripheral buffer layersINTEL CORP·Filed 2023·Application pending·0 cites
- 2851US12068172B2Sacrificial pads to prevent galvanic corrosion of FLI bumps in EMIB packagesINTEL CORP·Filed 2019·Granted Aug 20, 2024·0 cites·13 claims
- 2951US2025183182A1Microelectronic assemblies with through-glass via stress alleviation in glass coresSHAN BOHAN·Filed 2023·Application pending·0 cites
- 3050US2024105575A1Electrolytic surface finish architectureINTEL CORP·Filed 2022·Application pending·0 cites
- 3150US2023197661A1Microelectronic assemblies with silicon nitride multilayerINTEL CORP·Filed 2021·Application pending·0 cites
- 3249US2023057384A1Hybrid carrier for electronic substrate technologiesINTEL CORP·Filed 2021·Application pending·0 cites
- 3349US2024006298A1Substrate having one or more electrical interconnectsINTEL CORP·Filed 2022·Application pending·0 cites
- 3449US2023076148A1Silicon nitride liner for promotion of mold adhesion in integrated circuitsINTEL CORP·Filed 2021·Application pending·0 cites
- 3548US2023204879A1Optical packaging using embedded-in-mold (eim) optical module integrationINTEL CORP·Filed 2021·Application pending·0 cites
- 3647US2023086920A1Dam surrounding a die on a substrateINTEL CORP·Filed 2021·Application pending·0 cites
- 3746US2023194778A1Integrated optical packageINTEL CORP·Filed 2021·Application pending·0 cites
- 3846US2021391264A1Microelectronic structures including bridgesINTEL CORP·Filed 2020·Application pending·0 cites
- 3945US11462432B2Dual side de-bonding in component carriers using photoablationINTEL CORP·Filed 2018·Granted Oct 4, 2022·0 cites·20 claims
- 4035US2020066626A1Pocket structures, materials, and methods for integrated circuit package supportsINTEL CORP·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →