Optical packaging using embedded-in-mold (eim) optical module integration

Abstract

In one embodiment, an optical module includes an electronic integrated circuit, a photonic integrated circuit, and a pluggable optical coupling connector. The photonic integrated circuit sends or receives optical signals. The pluggable optical coupling connector is adjacent to the photonic integrated circuit and includes a pluggable interface to optically couple a fiber array to the photonic integrated circuit. Further, the electronic integrated circuit, the photonic integrated circuit, and the pluggable optical coupling connector are all embedded in a mold.

1 . An optical module, comprising:
 an electronic integrated circuit (EIC);   a photonic integrated circuit (PIC) to send or receive optical signals; and   a pluggable optical coupling connector (POCC) adjacent to the PIC, wherein the POCC comprises a pluggable interface to optically couple a fiber array to the PIC;   wherein the EIC, the PIC, and the POCC are embedded in a mold.   
     
     
         2 . The optical module of  claim 1 , further comprising:
 a pluggable fiber array unit (PFAU), wherein the PFAU comprises the fiber array, and wherein the PFAU is configured to plug into the pluggable interface of the POCC to optically couple the fiber array to the PIC.   
     
     
         3 . The optical module of  claim 2 , wherein the POCC further comprises a collimation lens to collimate light that passes through the POCC. 
     
     
         4 . The optical module of  claim 2 , wherein the PFAU further comprises a refocusing lens to refocus light that passes through the PFAU. 
     
     
         5 . The optical module of  claim 2 , wherein:
 the PIC is face down in the mold, wherein the PIC is configured to emit light from a backside of the PIC;   the POCC is aligned with the backside of the PIC; and   the PFAU further comprises an angled mirror to orthogonally reflect light that passes through the PFAU;   wherein, when the PFAU is plugged into the pluggable interface of the POCC, light emitted from the backside of the PIC is directed through the POCC, into the PFAU, and reflected orthogonally by the angled mirror in the PFAU into the fiber array.   
     
     
         6 . The optical module of  claim 5 , wherein the PIC further comprises a collimation lens to collimate light that passes through the backside of the PIC. 
     
     
         7 . The optical module of  claim 2 , wherein the PFAU further comprises an optical isolator to restrict a direction in which light passes through the PFAU. 
     
     
         8 . The optical module of  claim 2 , wherein:
 the POCC further comprises a first angled mirror to orthogonally reflect light that passes through the POCC; and   the PFAU further comprises a second angled mirror to orthogonally reflect light that passes through the PFAU.   
     
     
         9 . The optical module of  claim 2 , further comprising:
 a hybrid interposer embedded in the mold, wherein the hybrid interposer comprises:
 one or more electrical interconnections between the EIC and the PIC; and 
 one or more optical interconnections between the PIC and the POCC. 
   
     
     
         10 . The optical module of  claim 9 , wherein:
 the hybrid interposer comprises a glass structure for the one or more optical interconnections; and   the glass structure comprises one or more through-glass vias for the one or more electrical interconnections.   
     
     
         11 . The optical module of  claim 9 , wherein the hybrid interposer further comprises a parabolic mirror to collimate light that passes between the PIC and the POCC through the hybrid interposer. 
     
     
         12 . The optical module of  claim 11 , wherein the POCC further comprises a refocusing lens to refocus light that passes between the hybrid interposer and the fiber array through the POCC. 
     
     
         13 . The optical module of  claim 9 , wherein the hybrid interposer further comprises an angled mirror to orthogonally reflect light that passes between the PIC and the POCC through the hybrid interposer. 
     
     
         14 . The optical module of  claim 13 , wherein:
 the POCC further comprises a second angled mirror to orthogonally reflect light that passes between the hybrid interposer and the PFAU through the POCC; and   the PFAU further comprises a third angled mirror to orthogonally reflect light that passes between the POCC and the fiber array through the PFAU.   
     
     
         15 . The optical module of  claim 1 , wherein the mold comprises a dielectric material. 
     
     
         16 . A computing device, comprising:
 processing circuitry;   memory circuitry; and   communication circuitry, wherein the communication circuitry comprises an optical transceiver to send and receive optical transmissions, wherein the optical transceiver comprises:
 an electronic integrated circuit (EIC); 
 a photonic integrated circuit (PIC); and 
 a pluggable optical coupling connector (POCC) adjacent to the PIC, wherein the POCC comprises a pluggable interface to optically couple a fiber array to the PIC; 
 wherein the EIC, the PIC, and the POCC are embedded in a mold. 
   
     
     
         17 . The computing device of  claim 16 , wherein the optical transceiver further comprises:
 a pluggable fiber array unit (PFAU), wherein the PFAU comprises the fiber array, and wherein the PFAU is configured to plug into the pluggable interface of the POCC to optically couple the fiber array to the PIC.   
     
     
         18 . The computing device of  claim 16 , wherein the optical transceiver further comprises:
 a hybrid interposer embedded in the mold, wherein the hybrid interposer comprises:
 one or more electrical interconnections between the EIC and the PIC; and 
 one or more optical interconnections between the PIC and the POCC. 
   
     
     
         19 . A method of packaging an optical module, comprising:
 forming interconnect structures on a wafer;   bonding an electronic integrated circuit (EIC) and a photonic integrated circuit (PIC) face down on the wafer, wherein the EIC and the PIC are aligned with the interconnect structures;   bonding a pluggable optical coupling connector (POCC) on a backside of the PIC, wherein the POCC comprises:
 a pluggable interface to optically couple a fiber array to the PIC; and 
 a temporary cover lid to protect the pluggable interface from contamination; 
   embedding the EIC, the PIC, and the POCC in a mold;   grinding a top surface of the mold to remove the temporary cover lid of the POCC;   releasing the wafer;   forming a ball array below the optical module; and   singulating the optical module.   
     
     
         20 . The method of  claim 19 , further comprising:
 plugging a pluggable fiber array unit (PFAU) into the POCC, wherein the PFAU comprises the fiber array, and wherein the PFAU is configured to plug into the pluggable interface of the POCC to optically couple the fiber array to the PIC.