Inventor · disambiguated record
Thuy L. Tran-Quinn
Also filed as: TRAN QUINN THUY · TRAN-QUINN THUY L
5 granted patents·1 pending application·21 citations·filing 2011–2016
74Inventor score
Top patents by PatentIndex Score
6 records- 0192US9805977B1Integrated circuit structure having through-silicon via and method of forming sameGLOBALFOUNDRIES INC·Filed 2016·Granted Oct 31, 2017·16 cites·20 claims
- 0269US8907494B2Electrical leakage reduction in stacked integrated circuits having through-silicon-via (TSV) structuresIBM·Filed 2013·Granted Dec 9, 2014·2 cites·15 claims
- 0364US9252133B2Electrical leakage reduction in stacked integrated circuits having through-silicon-via (TSV) structuresGLOBALFOUNDRIES INC·Filed 2014·Granted Feb 2, 2016·1 cites·5 claims
- 0463US8614512B2Solder ball contact susceptible to lower stressGUERIN LUC·Filed 2012·Granted Dec 24, 2013·2 cites·18 claims
- 0546US8383505B2Solder ball contact susceptible to lower stressIBM·Filed 2011·Granted Feb 26, 2013·0 cites·15 claims
- 0631US2017170048A1Wafer handler for infrared laser releaseGLOBALFOUNDRIES INC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →