Inventor · disambiguated record
Yoko Sekihara
Also filed as: SEKIHARA YOKO
1 granted patent·2 pending applications·0 citations·filing 2015–2018
13Inventor score
Files withINTEL CORP3
Top patents by PatentIndex Score
3 records- 0153US10636716B2Through-mold structuresINTEL CORP·Filed 2018·Granted Apr 28, 2020·0 cites·17 claims
- 0244US2017178990A1Through-mold structuresINTEL CORP·Filed 2015·Application pending·0 cites
- 0332US2018090471A1Package on Package Structure Having Package To Package Interconnect Composed of Packed Wires Having A Polygon Cross SectionINTEL CORP·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →