Inventor · disambiguated record
Steve Joseph Bezuk
Also filed as: BEZUK STEVE · BEZUK STEVE J · BEZUK STEVE JOSEPH
6 granted patents·3 pending applications·72 citations·filing 1989–2019
80Inventor score
Top patents by PatentIndex Score
9 records- 0180US9171782B2Stacked redistribution layers on dieQUALCOMM INC·Filed 2013·Granted Oct 27, 2015·6 cites·32 claims
- 0273US4845542AInterconnect for layered integrated circuit assemblyUNISYS CORP·Filed 1989·Granted Jul 4, 1989·41 cites·11 claims
- 0368US9209110B2Integrated device comprising wires as vias in an encapsulation layerQUALCOMM INC·Filed 2014·Granted Dec 8, 2015·2 cites·27 claims
- 0464US9318405B2Wafer level package without sidewall crackingQUALCOMM INC·Filed 2015·Granted Apr 19, 2016·1 cites·20 claims
- 0561US5441195AMethod of stretching solder jointsUNISYS CORP·Filed 1994·Granted Aug 15, 1995·22 cites·19 claims
- 0656US2020066964A1Interface substrate and method of making the sameQUALCOMM INC·Filed 2019·Application pending·0 cites
- 0753US10516092B2Interface substrate and method of making the sameQUALCOMM INC·Filed 2016·Granted Dec 24, 2019·0 cites·10 claims
- 0836US2011204517A1Semiconductor Device with Vias Having More Than One MaterialQUALCOMM INC·Filed 2010·Application pending·0 cites
- 0932US2017373032A1Redistribution layer (rdl) fan-out wafer level packaging (fowlp) structureQUALCOMM INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →