Inventor · disambiguated record
Andy Cowley
Also filed as: COWLEY ANDY
14 granted patents·5 pending applications·238 citations·filing 2000–2008
93Inventor score
Top patents by PatentIndex Score
19 records- 0189US7241681B2Bilayered metal hardmasks for use in dual damascene etch schemesIBM·Filed 2006·Granted Jul 10, 2007·13 cites·8 claims
- 0287US6784105B1Simultaneous native oxide removal and metal neutral deposition methodINFINEON TECHNOLOGIES CORP·Filed 2003·Granted Aug 31, 2004·45 cites·16 claims
- 0383US7060619B2Reduction of the shear stress in copper via's in organic interlayer dielectric materialINFINEON TECHNOLOGIES AG·Filed 2003·Granted Jun 13, 2006·39 cites·16 claims
- 0479US6806579B2Robust via structure and methodINFINEON TECHNOLOGIES AG·Filed 2003·Granted Oct 19, 2004·29 cites·40 claims
- 0578US6872648B2Reduced splattering of unpassivated laser fusesINFINEON TECHNOLOGIES AG·Filed 2002·Granted Mar 29, 2005·26 cites·16 claims
- 0676US7052621B2Bilayered metal hardmasks for use in Dual Damascene etch schemesIBM·Filed 2003·Granted May 30, 2006·15 cites·15 claims
- 0774US6638851B2Dual hardmask single damascene integration scheme in an organic low k ILDINFINEON TECHNOLOGIES CORP·Filed 2001·Granted Oct 28, 2003·23 cites·15 claims
- 0870US6758223B1Plasma RIE polymer removalINFINEON TECHNOLOGIES AG·Filed 2000·Granted Jul 6, 2004·12 cites·7 claims
- 0966US6864171B1Via density rulesINFINEON TECHNOLOGIES AG·Filed 2003·Granted Mar 8, 2005·13 cites·15 claims
- 1062US7125792B2Dual damascene structure and methodIBM·Filed 2003·Granted Oct 24, 2006·8 cites·24 claims
- 1158US7091612B2Dual damascene structure and methodIBM·Filed 2003·Granted Aug 15, 2006·8 cites·26 claims
- 1254US7041574B2Composite intermetal dielectric structure including low-k dielectric materialINFINEON TECHNOLOGIES AG·Filed 2004·Granted May 9, 2006·5 cites·14 claims
- 1352US7786007B2Method and apparatus of stress relief in semiconductor structuresINFINEON TECHNOLOGIES AG·Filed 2008·Granted Aug 31, 2010·0 cites·18 claims
- 1447US7368804B2Method and apparatus of stress relief in semiconductor structuresINFINEON TECHNOLOGIES AG·Filed 2003·Granted May 6, 2008·2 cites·19 claims
- 1544US2005221610A1Method and apparatus of stress relief in semiconductor structuresHOINKIS MARK·Filed 2005·Application pending·0 cites
- 1640US2002088476A1Plasma RIE polymer removalINFINEON TECHNOLOGIES CORP·Filed 2002·Application pending·0 cites
- 1739US2005208742A1Oxidized tantalum nitride as an improved hardmask in dual-damascene processingIBM·Filed 2004·Application pending·0 cites
- 1839US2004248400A1Composite low-k dielectric structureFiled 2003·Application pending·0 cites
- 1933US2002155676A1Zero mask MIMcap process for a low k BEOLFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →