Inventor · disambiguated record
Hyon-Chol Kim
Also filed as: KIM HYON-CHOL
6 granted patents·3 pending applications·132 citations·filing 2011–2024
85Inventor score
Technology areasH10W
Top patents by PatentIndex Score
9 records- 0194US8791562B2Stack package and semiconductor package including the sameLEE CHUNG-SUN·Filed 2011·Granted Jul 29, 2014·34 cites·17 claims
- 0294US8604614B2Semiconductor packages having warpage compensationKWON HEUNG-KYU·Filed 2011·Granted Dec 10, 2013·19 cites·17 claims
- 0393US10431536B2Interposer substrate and semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 1, 2019·53 cites·20 claims
- 0492US10546844B2Stack package and method of manufacturing the stack packageSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jan 28, 2020·15 cites·16 claims
- 0586US9048168B2Semiconductor packages having warpage compensationSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jun 2, 2015·7 cites·20 claims
- 0679US9040351B2Stack packages having fastening element and halogen-free inter-package connectorSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted May 26, 2015·4 cites·20 claims
- 0752US2025266408A1Passive component embedded substrate and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0847US2012280404A1Stack packages having fastening element and halogen-free inter-package connectorKWON HEUNG-KYU·Filed 2012·Application pending·0 cites
- 0941US2014061841A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →