Inventor · disambiguated record
Bocheng Cao
Also filed as: CAO BOCHENG
3 granted patents·3 pending applications·2 citations·filing 2013–2025
49Inventor score
Top patents by PatentIndex Score
6 records- 0159US12356705B2Electrical contact cavity structure and methods of forming the sameAPPLIED MATERIALS INC·Filed 2024·Granted Jul 8, 2025·0 cites·26 claims
- 0259US9653588B2GaN substrate, semiconductor device and method for fabricating GaN substrate and semiconductor deviceHUAWEI TECH CO LTD·Filed 2014·Granted May 16, 2017·2 cites·17 claims
- 0359US2024184207A1Euv photoresist and underlayer adhesion modulationAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 0456US2025391708A1Substrate processing for improved wafer thickness uniformityAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 0551US2025316491A1Integrated substrate thinningAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 0645US8907720B2Capacitive switch, apparatus for transceiving signal, and manufacturing method thereofHUAWEI DEVICE CO LTD·Filed 2013·Granted Dec 9, 2014·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →