Inventor · disambiguated record
Eddy Tjhia
Also filed as: TJHIA EDDY
9 granted patents·324 citations·filing 1994–2011
90Inventor score
Files withSILICONIX INC3FAIRCHILD SEMICONDUCTOR2GRUENHAGEN MICHAEL D2JEON OSEOB1NAT SEMICONDUCTOR CORP1
Top patents by PatentIndex Score
9 records- 0196US6392290B1Vertical structure for semiconductor wafer-level chip scale packagesSILICONIX INC·Filed 2000·Granted May 21, 2002·171 cites·23 claims
- 0288USD466873SSemiconductor chip packageSILICONIX INC·Filed 2001·Granted Dec 10, 2002·43 cites·1 claims
- 0387USD472528SSemiconductor chip packageSILICONIX INC·Filed 2001·Granted Apr 1, 2003·56 cites·1 claims
- 0486US8193043B2High-power semiconductor die packages with integrated heat-sink capability and methods of manufacturing the sameJEON OSEOB·Filed 2010·Granted Jun 5, 2012·9 cites·18 claims
- 0582US7800219B2High-power semiconductor die packages with integrated heat-sink capability and methods of manufacturing the sameFAIRCHILD SEMICONDUCTOR·Filed 2008·Granted Sep 21, 2010·10 cites·9 claims
- 0679US8058732B2Semiconductor die structures for wafer-level chipscale packaging of power devices, packages and systems for using the same, and methods of making the sameGRUENHAGEN MICHAEL D·Filed 2008·Granted Nov 15, 2011·10 cites·33 claims
- 0773US7960800B2Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the sameFAIRCHILD SEMICONDUCTOR·Filed 2008·Granted Jun 14, 2011·5 cites·13 claims
- 0872US8598035B2Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the sameGRUENHAGEN MICHAEL D·Filed 2011·Granted Dec 3, 2013·3 cites·10 claims
- 0955US5482819APhotolithographic process for reducing repeated defectsNAT SEMICONDUCTOR CORP·Filed 1994·Granted Jan 9, 1996·17 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →