Assignee
JEON OSEOB
KR·3 granted patents·40 citations·filing 2010–2012
Top patents by PatentIndex Score
3 records- 0194US8183088B2Semiconductor die package and method for making the sameJEON OSEOB·Filed 2010·Granted May 22, 2012·22 cites·14 claims
- 0287US8664752B2Semiconductor die package and method for making the sameJEON OSEOB·Filed 2012·Granted Mar 4, 2014·9 cites·10 claims
- 0386US8193043B2High-power semiconductor die packages with integrated heat-sink capability and methods of manufacturing the sameJEON OSEOB·Filed 2010·Granted Jun 5, 2012·9 cites·18 claims
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