Inventor · disambiguated record
Yong-Zhong Hu
Also filed as: HU YONG · HU YONG-ZHONG
12 granted patents·20 pending applications·19 citations·filing 2001–2025
84Inventor score
Files withRICHTEK TECHNOLOGY CORP25ALPHA & OMEGA SEMICONDUCTOR2FAIRCHILD KOREA SEMICONDUCTOR LTD1SEAGATE TECHNOLOGY1SEMICONDUCTOR COMPONENTS IND LLC1
Top patents by PatentIndex Score
32 records- 0192US11522536B2Switch capable of decreasing parasitic inductanceRICHTEK TECHNOLOGY CORP·Filed 2022·Granted Dec 6, 2022·3 cites·10 claims
- 0283US8053315B2Method to manufacture split gate with high density plasma oxide layer as inter-polysilicon insulation layerALPHA & OMEGA SEMICONDUCTOR·Filed 2009·Granted Nov 8, 2011·10 cites·10 claims
- 0376US12512395B2Chip packaging method and chip package unitRICHTEK TECHNOLOGY CORP·Filed 2024·Granted Dec 30, 2025·0 cites·7 claims
- 0474US12272592B2High voltage device and manufacturing method thereofRICHTEK TECHNOLOGY CORP·Filed 2024·Granted Apr 8, 2025·0 cites·11 claims
- 0573US2025308908A1Pip structure and manufacturing methods of high voltage device and capacitor device having pip structureRICHTEK TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 0667US12300565B2Chip package unit and chip packaging methodRICHTEK TECHNOLOGY CORP·Filed 2022·Granted May 13, 2025·0 cites·9 claims
- 0766US12362186B2Pip structure and manufacturing methods of high voltage device and capacitor device having PIP structureRICHTEK TECHNOLOGY CORP·Filed 2022·Granted Jul 15, 2025·0 cites·13 claims
- 0865US11973010B2Chip packaging method and chip package unitRICHTEK TECHNOLOGY CORP·Filed 2021·Granted Apr 30, 2024·0 cites·12 claims
- 0963US12062570B2High voltage device and manufacturing method thereofRICHTEK TECHNOLOGY CORP·Filed 2021·Granted Aug 13, 2024·0 cites·11 claims
- 1063US2025233383A1Optoelectronic chip integrated system and manufacturing method thereofZhejiang Lab·Filed 2023·Application pending·0 cites
- 1162US6968731B2High speed glide test for screening magnetic disc micro-waviness and a system thereforSEAGATE TECHNOLOGY·Filed 2003·Granted Nov 29, 2005·6 cites·20 claims
- 1260US2025385032A1Apparatus having an inductor and a high thermal conductivity frame and manufacturing method thereofRICHTEK TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 1360US2025140630A1Chip package unit and chip packaging methodRICHTEK TECHNOLOGY CORP·Filed 2025·Application pending·0 cites
- 1459US11183495B2Power semiconductor devicesSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Nov 23, 2021·0 cites·20 claims
- 1559US2025233058A1Semiconductor package structure and method of fabricating the sameRICHTEK TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 1659US2025201647A1Package structureRICHTEK TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 1759US2025234598A1Combination structure of semiconductor deep trench devices and manufacturing method thereofRICHTEK TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 1859US2025287670A1Manufacturing method of power device having dual polysilicon gateRICHTEK TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 1958US2024203840A1Lead frame and package methodRICHTEK TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
- 2055US2024030297A1Integrated structure of semiconductor devices having shared contact plug and manufacturing method thereofRICHTEK TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
- 2154US2025142873A1Depletion Type Vertical Discrete NMOS Device and Manufacturing Method ThereofRICHTEK TECHNOLOGY CORP·Filed 2024·Application pending·0 cites
- 2254US2024014154A1Semiconductor device with pad structure resistant to plasma damage and manufacturing method thereofRICHTEK TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
- 2354US2024105844A1Native nmos device and manufacturing method thereofRICHTEK TECHNOLOGY CORP·Filed 2023·Application pending·0 cites
- 2452US2023163042A1Package structure and packaging methodRICHTEK TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
- 2551US11469162B2Plurality of vertical heat conduction elements attached to metal filmRICHTEK TECHNOLOGY CORP·Filed 2021·Granted Oct 11, 2022·0 cites·13 claims
- 2649US2023131821A1Heat dissipation structure and high thermal conduction elementRICHTEK TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
- 2749US2023098393A1Lead frame and packaging methodRICHTEK TECHNOLOGY CORP·Filed 2022·Application pending·0 cites
- 2848US2022208628A1Chip packaging structureRICHTEK TECHNOLOGY CORP·Filed 2021·Application pending·0 cites
- 2947US10366981B2Power semiconductor devicesFAIRCHILD KOREA SEMICONDUCTOR LTD·Filed 2015·Granted Jul 30, 2019·0 cites·19 claims
- 3046US2022157622A1Chip packaging method and chip package unitRICHTEK TECHNOLOGY CORP·Filed 2021·Application pending·0 cites
- 3145US2008150013A1Split gate formation with high density plasma (HDP) oxide layer as inter-polysilicon insulation layerALPHA & OMEGA SEMICONDUCTOR·Filed 2006·Application pending·0 cites
- 3237US2003065495A1Disc drive head-media spacing modeling and applicationsFiled 2001·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →