Inventor · disambiguated record
Tanya A. Atanasova
Also filed as: ATANASOVA TANYA · ATANASOVA TANYA A · ATANASOVA TANYA ANDREEVA
6 granted patents·2 pending applications·7 citations·filing 2010–2018
71Inventor score
Top patents by PatentIndex Score
8 records- 0178US10712499B2Semiconductor devices and methods of forming sameGLOBALFOUNDRIES INC·Filed 2018·Granted Jul 14, 2020·4 cites·19 claims
- 0266US9214436B2Etching of under bump mettallization layer and resulting deviceGLOBALFOUNDRIES INC·Filed 2014·Granted Dec 15, 2015·2 cites·11 claims
- 0364US10103119B2Methods of forming integrated circuit structure for joining wafers and resulting structureGLOBALFOUNDRIES INC·Filed 2017·Granted Oct 16, 2018·1 cites·12 claims
- 0450US10636759B2Methods of forming integrated circuit structure for joining wafers and resulting structureGLOBALFOUNDRIES INC·Filed 2018·Granted Apr 28, 2020·0 cites·19 claims
- 0541US9159683B2Methods for etching copper during the fabrication of integrated circuitsGLOBALFOUNDRIES INC·Filed 2014·Granted Oct 13, 2015·0 cites·14 claims
- 0641US2016043046A1Etching of under bump metallization layer and resulting deviceGLOBALFOUNDRIES INC·Filed 2015·Application pending·0 cites
- 0740US10236263B1Methods and structures for mitigating ESD during wafer bondingGLOBALFOUNDRIES INC·Filed 2017·Granted Mar 19, 2019·0 cites·14 claims
- 0828US2012097547A1Method for Copper ElectrodepositionVEREECKEN PHILIPPE M·Filed 2010·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Tanya A. Atanasova files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →