Inventor · disambiguated record
Chi-Tsung Chiu
Also filed as: CHIU CHI T · CHIU CHI-TSUNG
39 granted patents·12 pending applications·690 citations·filing 2000–2020
98Inventor score
Top patents by PatentIndex Score
51 records- 0198US7989928B2Semiconductor device packages with electromagnetic interference shieldingADVANCED SEMICONDUCTOR ENG·Filed 2009·Granted Aug 2, 2011·113 cites·18 claims
- 0298US7550836B2Structure of package on package and method for fabricating the sameADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Jun 23, 2009·130 cites·18 claims
- 0397US8022511B2Semiconductor device packages with electromagnetic interference shieldingADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Sep 20, 2011·81 cites·21 claims
- 0495US8378466B2Wafer-level semiconductor device packages with electromagnetic interference shieldingADVANCED SEMICONDUCTOR ENG·Filed 2009·Granted Feb 19, 2013·68 cites·25 claims
- 0594US10186467B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jan 22, 2019·10 cites·20 claims
- 0694US8212339B2Semiconductor device packages with electromagnetic interference shieldingLIAO KUO-HSIEN·Filed 2010·Granted Jul 3, 2012·28 cites·20 claims
- 0792US9171792B2Semiconductor device packages having a side-by-side device arrangement and stacking functionalitySUN YU-CHING·Filed 2011·Granted Oct 27, 2015·39 cites·19 claims
- 0892US7586184B2Electronic packageADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Sep 8, 2009·29 cites·19 claims
- 0991US9172131B2Semiconductor structure having aperture antennaADVANCED SEMICONDUCTOR ENG·Filed 2013·Granted Oct 27, 2015·14 cites·20 claims
- 1091US8653633B2Semiconductor device packages with electromagnetic interference shieldingLIAO KUO-HSIEN·Filed 2011·Granted Feb 18, 2014·13 cites·20 claims
- 1190US8350367B2Semiconductor device packages with electromagnetic interference shieldingADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Jan 8, 2013·21 cites·24 claims
- 1290US7944038B2Semiconductor package having an antenna on the molding compound thereofADVANCED SEMICONDUCTOR ENG·Filed 2009·Granted May 17, 2011·25 cites·10 claims
- 1388US8653634B2EMI-shielded semiconductor devices and methods of makingCHIU CHI TSUNG·Filed 2012·Granted Feb 18, 2014·13 cites·16 claims
- 1486US9991193B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jun 5, 2018·4 cites·20 claims
- 1583US7145428B2Circuit substrateADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Dec 5, 2006·12 cites·20 claims
- 1680US8502623B2Band pass filterLEE PAO-NAN·Filed 2009·Granted Aug 6, 2013·14 cites·5 claims
- 1779US7248134B2Inductor and capacitor formed of build-up viasADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Jul 24, 2007·8 cites·6 claims
- 1875US10707157B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jul 7, 2020·2 cites·14 claims
- 1972US6403896B1Substrate having specific pad distributionADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted Jun 11, 2002·19 cites·10 claims
- 2070US6933605B2Semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Aug 23, 2005·14 cites·7 claims
- 2169US11133245B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Sep 28, 2021·1 cites·17 claims
- 2268US7297877B2Substrate with micro-via structures by laser techniqueADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Nov 20, 2007·12 cites·12 claims
- 2367US10083888B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Sep 25, 2018·1 cites·17 claims
- 2467US8368202B2Semiconductor device and semiconductor package having the sameADVANCED SEMICONDUCTOR ENG·Filed 2010·Granted Feb 5, 2013·2 cites·19 claims
- 2567US8049116B2Circuit substrate and method for fabricating inductive circuitADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Nov 1, 2011·4 cites·11 claims
- 2665US11728252B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Aug 15, 2023·0 cites·15 claims
- 2763US9564393B1Semiconductor device package and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Feb 7, 2017·1 cites·20 claims
- 2862US8350361B2Semiconductor element having a conductive via and method for making the same and package having a semiconductor element with a conductive viaADVANCED SEMICONDUCTOR ENG·Filed 2010·Granted Jan 8, 2013·1 cites·18 claims
- 2961US8963671B2Semiconductor transformer device and method for manufacturing the sameCHEN CHI-HAN·Filed 2012·Granted Feb 24, 2015·2 cites·13 claims
- 3057US2020194327A1Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2020·Application pending·0 cites
- 3156US11037868B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Jun 15, 2021·0 cites·17 claims
- 3254US10615105B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Apr 7, 2020·0 cites·18 claims
- 3352US2018358276A1Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2018·Application pending·0 cites
- 3450US7084639B2Impedance standard substrate and method for calibrating vector network analyzerADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Aug 1, 2006·4 cites·13 claims
- 3549US11127707B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Sep 21, 2021·0 cites·20 claims
- 3648US8486829B2Semiconductor element having a conductive via and method for making the same and package having a semiconductor element with a conductive viaCHIU CHI-TSUNG·Filed 2012·Granted Jul 16, 2013·0 cites·6 claims
- 3746US7932591B2Stacked semiconductor package having flexible circuit board thereinADVANCED SEMICONDUCTOR ENG·Filed 2007·Granted Apr 26, 2011·0 cites·8 claims
- 3846US7072780B2Impedance standard substrate and correction method for vector network analyzerADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Jul 4, 2006·3 cites·10 claims
- 3945US6770979B2Semiconductor package and substrate thereofADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Aug 3, 2004·2 cites·14 claims
- 4045US2005189641A1Semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2005·Application pending·0 cites
- 4144US12033923B2Semiconductor package structure having a lead frame and a passive componentADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Jul 9, 2024·0 cites·16 claims
- 4244US2008116556A1Package structure having through hole in spacer thereofADVANCED SEMICONDUCTOR ENG·Filed 2007·Application pending·0 cites
- 4344US2008054450A1Chip package structure and heat sink for chip packageADVANCED SEMICONDUCTOR ENG·Filed 2007·Application pending·0 cites
- 4443US2010071939A1Substrate of window ball grid array packageCHENG HUNG-HSIANG·Filed 2009·Application pending·0 cites
- 4542US7053627B2Impedance standard substrate and method for calibrating vector network analyzerADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted May 30, 2006·0 cites·11 claims
- 4642US2007267758A1Semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
- 4741US2005046046A1Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2004·Application pending·0 cites
- 4840US2006108690A1Circuit board with reduced simultaneous switching noiseADVANCED SEMICONDUCTOR ENG·Filed 2005·Application pending·0 cites
- 4940US2010265009A1Stacked lc resonator and bandpass filter of using the sameUNIV NAT SUN YAT SEN·Filed 2009·Application pending·0 cites
- 5039US2004089929A1Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2003·Application pending·0 cites
Showing the top 50 of 51 patent records by PatentIndex Score.
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