Inventor · disambiguated record
Jivko Dinev
Also filed as: DINEV JIVKO
6 granted patents·2 pending applications·27 citations·filing 2006–2014
77Inventor score
Top patents by PatentIndex Score
8 records- 0182US8475625B2Apparatus for etching high aspect ratio featuresPAMARTHY SHARMA·Filed 2006·Granted Jul 2, 2013·15 cites·22 claims
- 0275US7554334B2Matching network characterization using variable impedance analysisAPPLIED MARTERIALS INC·Filed 2006·Granted Jun 30, 2009·7 cites·19 claims
- 0371US9236305B2Wafer dicing with etch chamber shield ring for film frame wafer applicationsAPPLIED MATERIALS INC·Filed 2014·Granted Jan 12, 2016·2 cites·14 claims
- 0465US8920599B2High efficiency gas dissociation in inductively coupled plasma reactor with improved uniformityDINEV JIVKO·Filed 2011·Granted Dec 30, 2014·2 cites·13 claims
- 0554US8596336B2Substrate support temperature controlFOVELL RICHARD·Filed 2008·Granted Dec 3, 2013·1 cites·23 claims
- 0642US2010099266A1Etch reactor suitable for etching high aspect ratio featuresAPPLIED MATERIALS INC·Filed 2009·Application pending·0 cites
- 0738US2014179108A1Wafer Edge Protection and Efficiency Using Inert Gas and RingAPPLIED MATERIALS INC·Filed 2013·Application pending·0 cites
- 0837US9023227B2Increased deposition efficiency and higher chamber conductance with source power increase in an inductively coupled plasma (ICP) chamberDINEV JIVKO·Filed 2012·Granted May 5, 2015·0 cites·20 claims
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