Inventor · disambiguated record
Lawrence Douglas Andrews, Jr.
Also filed as: ANDREWS JR LAWRENCE DOUGLAS · ANDREWS LAWRENCE D
9 granted patents·5 pending applications·202 citations·filing 2008–2023
89Inventor score
Files withMCELREA SIMON J S5VERTICAL CIRCUITS INC5AGILENT TECHNOLOGIES INC1ANDREWS JR LAWRENCE DOUGLAS1CASKEY TERRENCE1
Top patents by PatentIndex Score
14 records- 0197US8178978B2Support mounted electrically interconnected die assemblyMCELREA SIMON J S·Filed 2009·Granted May 15, 2012·77 cites·38 claims
- 0294US7923349B2Wafer level surface passivation of stackable integrated circuit chipsVERTICAL CIRCUITS INC·Filed 2008·Granted Apr 12, 2011·37 cites·25 claims
- 0393US8723332B2Electrically interconnected stacked die assembliesMCELREA SIMON J S·Filed 2008·Granted May 13, 2014·35 cites·38 claims
- 0493US8629543B2Electrically interconnected stacked die assembliesMCELREA SIMON J S·Filed 2010·Granted Jan 14, 2014·19 cites·29 claims
- 0591US7843046B2Flat leadless packages and stacked leadless package assembliesVERTICAL CIRCUITS INC·Filed 2008·Granted Nov 30, 2010·21 cites·34 claims
- 0686US9305862B2Support mounted electrically interconnected die assemblyMCELREA SIMON J S·Filed 2012·Granted Apr 5, 2016·7 cites·17 claims
- 0773US8159053B2Flat leadless packages and stacked leadless package assembliesANDREWS JR LAWRENCE DOUGLAS·Filed 2010·Granted Apr 17, 2012·4 cites·27 claims
- 0867US8324081B2Wafer level surface passivation of stackable integrated circuit chipsMCELREA SIMON J S·Filed 2011·Granted Dec 4, 2012·2 cites·9 claims
- 0961US2024255538A1Liquid dispensing device for filling multiple containersAGILENT TECHNOLOGIES INC·Filed 2023·Application pending·0 cites
- 1049US2016218088A1Support mounted electrically interconnected die assemblyINVENSAS CORP·Filed 2016·Application pending·0 cites
- 1147US8742602B2Vertical electrical interconnect formed on support prior to die mountCASKEY TERRENCE·Filed 2008·Granted Jun 3, 2014·0 cites·20 claims
- 1245US2009068790A1Electrical Interconnect Formed by Pulsed DispenseVERTICAL CIRCUITS INC·Filed 2008·Application pending·0 cites
- 1345US2008315407A1Three-dimensional circuitry formed on integrated circuit device using two-dimensional fabricationVERTICAL CIRCUITS INC·Filed 2008·Application pending·0 cites
- 1445US2009102038A1Chip scale stacked die packageVERTICAL CIRCUITS INC·Filed 2008·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →