Inventor · disambiguated record
Trung T. Doan
Also filed as: DOAN TRUNG · DOAN TRUNG T · DOAN TRUNG TRI
448 granted patents·43 pending applications·25,592 citations·filing 1989–2024
99Inventor score
Files withMICRON TECHNOLOGY INC358SEMILEDS OPTOELECTRONICS CO24SEMILEDS CORP16APPLIED MATERIALS INC14DOAN TRUNG TRI10
Top patents by PatentIndex Score
491 records- 0199US7422635B2Methods and apparatus for processing microfeature workpieces, e.g., for depositing materials on microfeature workpiecesMICRON TECHNOLOGY INC·Filed 2003·Granted Sep 9, 2008·483 cites·17 claims
- 0299US7221059B2Wafer level semiconductor component having thinned, encapsulated dice and polymer damMICRON TECHNOLOGY INC·Filed 2005·Granted May 22, 2007·61 cites·18 claims
- 0399US7029949B2Method for fabricating encapsulated semiconductor components having conductive viasMICRON TECHNOLOGY INC·Filed 2003·Granted Apr 18, 2006·141 cites·37 claims
- 0499US6964915B2Method of fabricating encapsulated semiconductor components by etchingMICRON TECHNOLOGY INC·Filed 2003·Granted Nov 15, 2005·150 cites·23 claims
- 0599US6908784B1Method for fabricating encapsulated semiconductor componentsMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 21, 2005·419 cites·75 claims
- 0699US6423621B2Controllable ovonic phase-change semiconductor memory device and methods of fabricating the sameMICRON TECHNOLOGY INC·Filed 2001·Granted Jul 23, 2002·369 cites·16 claims
- 0799US6338667B2System for real-time control of semiconductor wafer polishingMICRON TECHNOLOGY INC·Filed 2000·Granted Jan 15, 2002·101 cites·19 claims
- 0899US6261151B1System for real-time control of semiconductor wafer polishingMICRON TECHNOLOGY INC·Filed 2000·Granted Jul 17, 2001·138 cites·13 claims
- 0999US6150253AControllable ovonic phase-change semiconductor memory device and methods of fabricating the sameMICRON TECHNOLOGY INC·Filed 1997·Granted Nov 21, 2000·414 cites·9 claims
- 1099US5851135ASystem for real-time control of semiconductor wafer polishingMICRON TECHNOLOGY INC·Filed 1997·Granted Dec 22, 1998·238 cites·19 claims
- 1199US5730642ASystem for real-time control of semiconductor wafer polishing including optical montoringMICRON TECHNOLOGY INC·Filed 1997·Granted Mar 24, 1998·424 cites·24 claims
- 1299US5700180ASystem for real-time control of semiconductor wafer polishingMICRON TECHNOLOGY INC·Filed 1995·Granted Dec 23, 1997·223 cites·21 claims
- 1399US5658183ASystem for real-time control of semiconductor wafer polishing including optical monitoringMICRON TECHNOLOGY INC·Filed 1995·Granted Aug 19, 1997·451 cites·4 claims
- 1499US5486129ASystem and method for real-time control of semiconductor a wafer polishing, and a polishing headMICRON TECHNOLOGY INC·Filed 1993·Granted Jan 23, 1996·491 cites·41 claims
- 1599US5421769AApparatus for planarizing semiconductor wafers, and a polishing pad for a planarization apparatusMICRON TECHNOLOGY INC·Filed 1993·Granted Jun 6, 1995·238 cites·30 claims
- 1699US5278100AChemical vapor deposition technique for depositing titanium silicide on semiconductor wafersMICRON TECHNOLOGY INC·Filed 1991·Granted Jan 11, 1994·1.3k cites·28 claims
- 1799US5234867AMethod for planarizing semiconductor wafers with a non-circular polishing padMICRON TECHNOLOGY INC·Filed 1992·Granted Aug 10, 1993·253 cites·4 claims
- 1898US11817536B2Method for making electronic device arrays using a temporary substrate and a carrier substrateSEMILEDS OPTOELECTRONICS CO·Filed 2022·Granted Nov 14, 2023·4 cites·16 claims
- 1998US11260500B2Retaining ring with shaped surfaceAPPLIED MATERIALS INC·Filed 2020·Granted Mar 1, 2022·4 cites·9 claims
- 2098US7186580B2Light emitting diodes (LEDs) with improved light extraction by rougheningSEMILEDS CORP·Filed 2005·Granted Mar 6, 2007·86 cites·18 claims
- 2198US7157353B2Method for fabricating encapsulated semiconductor componentsMICRON TECHNOLOGY INC·Filed 2005·Granted Jan 2, 2007·38 cites·15 claims
- 2298US6828175B2Semiconductor component with backside contacts and method of fabricationMICRON TECHNOLOGY INC·Filed 2003·Granted Dec 7, 2004·248 cites·27 claims
- 2398US6551893B1Atomic layer deposition of capacitor dielectricMICRON TECHNOLOGY INC·Filed 2001·Granted Apr 22, 2003·172 cites·21 claims
- 2498US5593927AMethod for packaging semiconductor diceMICRON TECHNOLOGY INC·Filed 1995·Granted Jan 14, 1997·342 cites·19 claims
- 2598US5439551AChemical-mechanical polishing techniques and methods of end point detection in chemical-mechanical polishing processesMICRON TECHNOLOGY INC·Filed 1994·Granted Aug 8, 1995·204 cites·6 claims
- 2698US5384284AMethod to form a low resistant bond pad interconnectMICRON SEMICONDUCTOR INC·Filed 1993·Granted Jan 24, 1995·405 cites·24 claims
- 2798US5344792APulsed plasma enhanced CVD of metal silicide conductive films such as TiSi2MICRON TECHNOLOGY INC·Filed 1993·Granted Sep 6, 1994·199 cites·14 claims
- 2898US5244534ATwo-step chemical mechanical polishing process for producing flush and protruding tungsten plugsMICRON TECHNOLOGY INC·Filed 1992·Granted Sep 14, 1993·396 cites·23 claims
- 2998US5232549ASpacers for field emission display fabricated via self-aligned high energy ablationMICRON TECHNOLOGY INC·Filed 1992·Granted Aug 3, 1993·229 cites·22 claims
- 3098US5205770AMethod to form high aspect ratio supports (spacers) for field emission display using micro-saw technologyMICRON TECHNOLOGY INC·Filed 1992·Granted Apr 27, 1993·153 cites·20 claims
- 3198US5196353AMethod for controlling a semiconductor (CMP) process by measuring a surface temperature and developing a thermal image of the waferMICRON TECHNOLOGY INC·Filed 1992·Granted Mar 23, 1993·487 cites·7 claims
- 3298US5186670AMethod to form self-aligned gate structures and focus ringsMICRON TECHNOLOGY INC·Filed 1992·Granted Feb 16, 1993·194 cites·20 claims
- 3397US11387397B2Method for making light emitting device (LED) arrays using a temporary substrate and a carrier substrateSEMILEDS OPTOELECTRONICS CO·Filed 2020·Granted Jul 12, 2022·3 cites·16 claims
- 3497US8871547B2Method for fabricating vertical light emitting diode (VLED) structure using a laser pulse to remove a carrier substrateSEMILEDS OPTOELECTRONICS CO·Filed 2014·Granted Oct 28, 2014·23 cites·17 claims
- 3597US7723718B1Epitaxial structure for metal devicesSEMILEDS OPTOELECTRONICS CO LT·Filed 2006·Granted May 25, 2010·29 cites·33 claims
- 3697US7432119B2Light emitting diode with conducting metal substrateSEMILEDS CORP·Filed 2005·Granted Oct 7, 2008·56 cites·6 claims
- 3797US7417325B2Semiconductor component having thinned die with conductive vias configured as conductive pin terminal contactsMICRON TECHNOLOGY INC·Filed 2006·Granted Aug 26, 2008·33 cites·9 claims
- 3897US7382060B2Semiconductor component having thinned die, polymer layers, contacts on opposing sides, and conductive vias connecting the contactsMICRON TECHNOLOGY INC·Filed 2005·Granted Jun 3, 2008·31 cites·20 claims
- 3997US7195944B2Systems and methods for producing white-light emitting diodesSEMILEDS CORP·Filed 2005·Granted Mar 27, 2007·80 cites·10 claims
- 4097US6903442B2Semiconductor component having backside pin contactsMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 7, 2005·168 cites·19 claims
- 4197US6863725B2Method of forming a Ta2O5 comprising layerMICRON TECHNOLOGY INC·Filed 2003·Granted Mar 8, 2005·109 cites·70 claims
- 4297US6683005B2Method of forming capacitor constructionsMICRON TECHNOLOGY INC·Filed 2003·Granted Jan 27, 2004·92 cites·13 claims
- 4397US6573199B2Methods of treating dielectric materials with oxygen, and methods of forming capacitor constructionsMICRON TECHNOLOGY INC·Filed 2001·Granted Jun 3, 2003·88 cites·7 claims
- 4497US6541353B1Atomic layer doping apparatus and methodMICRON TECHNOLOGY INC·Filed 2000·Granted Apr 1, 2003·147 cites·11 claims
- 4597US6358756B1Self-aligned, magnetoresistive random-access memory (MRAM) structure utilizing a spacer containment schemeMICRON TECHNOLOGY INC·Filed 2001·Granted Mar 19, 2002·163 cites·35 claims
- 4697US6300219B1Method of forming trench isolation regionsMICRON TECHNOLOGY INC·Filed 1999·Granted Oct 9, 2001·167 cites·39 claims
- 4797US5975994AMethod and apparatus for selectively conditioning a polished pad used in planarizng substratesMICRON TECHNOLOGY INC·Filed 1997·Granted Nov 2, 1999·182 cites·77 claims
- 4897US5514245AMethod for chemical planarization (CMP) of a semiconductor wafer to provide a planar surface free of microscratchesMICRON TECHNOLOGY INC·Filed 1995·Granted May 7, 1996·276 cites·17 claims
- 4997US5416048AMethod to slope conductor profile prior to dielectric deposition to improve dielectric step-coverageMICRON SEMICONDUCTOR INC·Filed 1993·Granted May 16, 1995·348 cites·20 claims
- 5097US5329207AField emission structures produced on macro-grain polysilicon substratesMICRON TECHNOLOGY INC·Filed 1992·Granted Jul 12, 1994·109 cites·20 claims
Showing the top 50 of 491 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →