Inventor · disambiguated record
Hsiang-Hung Chang
Also filed as: CHANG HSIANG-HUNG
10 granted patents·5 pending applications·115 citations·filing 2008–2024
87Inventor score
Top patents by PatentIndex Score
15 records- 0194US7663231B2Image sensor module with a three-dimensional die-stacking structureIND TECH RES INST·Filed 2008·Granted Feb 16, 2010·52 cites·9 claims
- 0288US8193632B2Three-dimensional conducting structure and method of fabricating the sameCHANG HSIANG-HUNG·Filed 2009·Granted Jun 5, 2012·34 cites·16 claims
- 0387US10361235B2Image sensorIND TECH RES INST·Filed 2016·Granted Jul 23, 2019·5 cites·16 claims
- 0486US10943938B2Image sensor and manufacturing method thereofIND TECH RES INST·Filed 2018·Granted Mar 9, 2021·4 cites·6 claims
- 0586US10520422B2Optical micro-particles detectorIND TECH RES INST·Filed 2017·Granted Dec 31, 2019·3 cites·22 claims
- 0686US7902674B2Three-dimensional die-stacking package structureIND TECH RES INST·Filed 2008·Granted Mar 8, 2011·15 cites·20 claims
- 0781US10458893B2Miniaturized particulate matter detector and manufacturing method of a filterIND TECH RES INST·Filed 2016·Granted Oct 29, 2019·2 cites·14 claims
- 0860US2025244526A1Optical module packaging structureIND TECH RES INST·Filed 2024·Application pending·0 cites
- 0959US12087665B2Through substrate via structure and manufacturing method thereof, redistribution layer structure and manufacturing method thereofIND TECH RES INST·Filed 2021·Granted Sep 10, 2024·0 cites·10 claims
- 1059US11508772B2Image sensor and manufacturing method thereofIND TECH RES INST·Filed 2021·Granted Nov 22, 2022·0 cites·7 claims
- 1153US12279460B2Electrostatic discharge protection devicePOWERCHIP SEMICONDUCTOR MFG CORP·Filed 2022·Granted Apr 15, 2025·0 cites·17 claims
- 1249US2015097259A1Conductive via structure, package structure, and package of photosensitive deviceIND TECH RES INST·Filed 2014·Application pending·0 cites
- 1349US2018145107A1Manufacturing method of image sensorIND TECH RES INST·Filed 2017·Application pending·0 cites
- 1442US2016043239A1Package structureIND TECH RES INST·Filed 2015·Application pending·0 cites
- 1532US2012133046A1Semiconductor structure and process thereofCHIEN CHUN-HSIEN·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →