Manufacturing method of image sensor

Abstract

A manufacturing method of an image sensor. A substrate is provided, and the substrate has an arc surface. A cover, an adhesive layer, and an image sensing element are provided. The adhesive layer is bonded between the cover and the image sensing element. The cover, the adhesive layer, and the image sensing element bonded together are aligned to the substrate. The cover, the adhesive layer, and the image sensing element are pressed onto the substrate, such that the image sensing element is pressed by the adhesive layer and is thus curved to fit a contour of the arc surface, and the image sensing element is encapsulated by the adhesive layer.

What is claimed is: 
     
         1 . A manufacturing method of an image sensor, comprising:
 providing a substrate, wherein the substrate has an arc surface;   providing a cover, an adhesive layer, and an image sensing element;   bonding the adhesive layer between the cover and the image sensing element; and   aligning the cover, the adhesive layer, and the image sensing element bonded together to the substrate and pressing the cover, the adhesive layer, and the image sensing element onto the substrate, such that the image sensing element is pressed by the adhesive layer and thus is curved to fit a contour of the arc surface, and the adhesive layer encapsulates the image sensing element.   
     
     
         2 . The manufacturing method of the image sensor as claimed in  claim 1 , comprising:
 curving the image sensing element such that a curvature of the image sensing element is identical to a curvature of the arc surface.   
     
     
         3 . The manufacturing method of the image sensor as claimed in  claim 1 , comprising:
 removing the cover after pressing the cover, the adhesive layer, and the image sensing element onto the substrate.   
     
     
         4 . The manufacturing method of the image sensor as claimed in  claim 1 , wherein the arc surface is a concave arc surface and forms a groove on the substrate, and the manufacturing method comprises:
 filling the groove by the adhesive layer.   
     
     
         5 . The manufacturing method of the image sensor as claimed in  claim 1 , wherein the substrate has a plurality of grooves for overflowed adhesive, the grooves for overflowed adhesive extend from a periphery of the image sensing element to an edge of the arc surface, the arc surface has a plurality of flanges, the flanges are arranged with intervals to form the grooves for overflowed adhesive, ends of the flanges form a positioning recess, and the manufacturing method comprises:
 positioning the image sensing element in the positioning recess.   
     
     
         6 . The manufacturing method of the image sensor as claimed in  claim 1 , wherein the image sensor comprises a conductive structure, the conductive structure is disposed on the substrate and extends from a bottom of the image sensing element to an outside of the arc surface, and the manufacturing method comprises:
 enabling the image sensing element and the conductive structure to be electrically connected to each other by at least one conductive element.