Inventor · disambiguated record
Hyo Soo Lee
Also filed as: LEE HYO S · LEE HYO SOO
7 granted patents·4 pending applications·51 citations·filing 1999–2020
81Inventor score
Top patents by PatentIndex Score
11 records- 0191US7346982B2Method of fabricating printed circuit board having thin core layerSAMSUNG ELECTRO MECH·Filed 2005·Granted Mar 25, 2008·26 cites·3 claims
- 0281US7414317B2BGA package with concave shaped bonding padsSAMSUNG ELECTRO MECH·Filed 2005·Granted Aug 19, 2008·12 cites·22 claims
- 0378US7829985B2BGA package having half-etched bonding pad and cut plating line and method of fabricating sameSAMSUNG ELECTRO MECH·Filed 2008·Granted Nov 9, 2010·7 cites·4 claims
- 0456US6491862B1Method for producing SiC preform with high volume fractionKOREA ADVANCED INST SCI & TECH·Filed 2000·Granted Dec 10, 2002·5 cites·7 claims
- 0548US2020086680A1Live metal and method of manufacturing the sameKOREA INST IND TECH·Filed 2017·Application pending·0 cites
- 0645US7298887B2System for and method of analyzing surface condition of PCB using RGB colorsSAMSUNG ELECTRO MECH·Filed 2003·Granted Nov 20, 2007·0 cites·9 claims
- 0744US2022233992A1Fine particle aggregation method and apparatusKOREA INST IND TECH·Filed 2020·Application pending·0 cites
- 0844US2006145343A1BGA package having half-etched bonding pad and cut plating line and method of fabricating sameSAMSUNG ELECTRO MECH·Filed 2005·Application pending·0 cites
- 0936US2006119867A1Thickness measuring method for organic coating film on metal surfaceSAMSUNG ELECTRO MECH·Filed 2005·Application pending·0 cites
- 1026US10190971B2Analyzing color of color alloy using reflectanceKOREA INST IND TECH·Filed 2015·Granted Jan 29, 2019·0 cites·17 claims
- 1125US6190604B1Process for preparing a preform with high volume fraction SiCKOREA ADVANCED INST SCI & TECH·Filed 1999·Granted Feb 20, 2001·1 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →