Inventor · disambiguated record
Jagdish Chandra Saraswatula
Also filed as: SARASWATULA JAGDISH · SARASWATULA JAGDISH CHANDRA
7 granted patents·6 pending applications·17 citations·filing 2016–2025
77Inventor score
Top patents by PatentIndex Score
13 records- 0187US10901391B1Multi-scanning electron microscopy for wafer alignmentZEISS CARL SMT GMBH·Filed 2019·Granted Jan 26, 2021·10 cites·20 claims
- 0282US9965848B2Shape based groupingKLA TENCOR CORP·Filed 2016·Granted May 8, 2018·4 cites·20 claims
- 0373US11119060B2Defect location accuracy using shape based grouping guided defect centeringKLA TENCOR CORP·Filed 2018·Granted Sep 14, 2021·2 cites·14 claims
- 0469US10503078B2Criticality analysis augmented process window qualification samplingKLA TENCOR CORP·Filed 2018·Granted Dec 10, 2019·1 cites·18 claims
- 0561US2025315940A1Computer implemented method, computer-readable medium, computer program product and corresponding systems for the prediction of defects in wafers and for offline wafer-less process window qualificationZEISS CARL SMT GMBH·Filed 2025·Application pending·0 cites
- 0656US2025259293A1Computer implemented method for the detection of defects in an imaging dataset of an object comprising integrated circuit patterns, computer-readable medium, computer program product and a system making use of such methodsZEISS CARL SMT GMBH·Filed 2025·Application pending·0 cites
- 0747US10714366B2Shape metric based scoring of wafer locationsKLA TENCOR CORP·Filed 2019·Granted Jul 14, 2020·0 cites·31 claims
- 0842US2021158498A1Wafer inspection methods and devicesZEISS CARL SMT GMBH·Filed 2019·Application pending·0 cites
- 0940US11035666B2Inspection-guided critical site selection for critical dimension measurementKLA TENCOR CORP·Filed 2018·Granted Jun 15, 2021·0 cites·16 claims
- 1038US10957608B2Guided scanning electron microscopy metrology based on wafer topographyKLA TENCOR CORP·Filed 2017·Granted Mar 23, 2021·0 cites·20 claims
- 1138US2021073976A1Wafer inspection methods and systemsZEISS CARL SMT GMBH·Filed 2019·Application pending·0 cites
- 1238US2020402863A1Methods and systems for defining a process windowZEISS CARL SMT GMBH·Filed 2019·Application pending·0 cites
- 1336US2019279914A1Region of interest and pattern of interest generation for critical dimension measurementKLA TENCOR CORP·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →