Inventor · disambiguated record
Makoto Tai
Also filed as: TAI MAKOTO
12 granted patents·6 pending applications·39 citations·filing 1996–2023
85Inventor score
Files withARISAWA SEISAKUSHO KK12DOBASHI SHU1JAPAN TOBACCO INC1MATSUYAMA HIROYUKI1OPTEC DAI ITCHI DENKO CO LTD1
Top patents by PatentIndex Score
18 records- 0184US7812953B2Mixture identification systemJAPAN TOBACCO INC·Filed 2008·Granted Oct 12, 2010·12 cites·14 claims
- 0278US11402754B2Photosensitive resin composition, solder resist film using said photosensitive resin composition, flexible printed wiring board, and image display deviceARISAWA SEISAKUSHO KK·Filed 2017·Granted Aug 2, 2022·2 cites·12 claims
- 0370US10627716B2Photosensitive resin composition, solder resist film using said photosensitive resin composition, flexible printed circuit and image display deviceARISAWA SEISAKUSHO KK·Filed 2017·Granted Apr 21, 2020·2 cites·9 claims
- 0468US11946143B2LaminateARISAWA SEISAKUSHO KK·Filed 2019·Granted Apr 2, 2024·0 cites·9 claims
- 0567US2024079606A1Fuel cell separator material, method for manufacturing fuel cell separator, and fuel cell separatorTOYOTA MOTOR CO LTD·Filed 2023·Application pending·0 cites
- 0665US11376826B2Multi-layer film and metal laminateARISAWA SEISAKUSHO KK·Filed 2019·Granted Jul 5, 2022·0 cites·13 claims
- 0758US8546511B2Polyamideimide resin for flexible printed circuit boards; metal-clad laminate, coverlay, and flexible printed circuit board that use this resin; and resin compositionTAI MAKOTO·Filed 2007·Granted Oct 1, 2013·1 cites·5 claims
- 0857US11317507B2Laminate and method for manufacturing the sameARISAWA SEISAKUSHO KK·Filed 2019·Granted Apr 26, 2022·0 cites·15 claims
- 0956US2016280979A1Adhesive resin compositionARISAWA SEISAKUSHO KK·Filed 2016·Application pending·0 cites
- 1055US2013316170A1Resin Composition for Flexible Printed Circuit BoardARISAWA SEISAKUSHO KK·Filed 2013·Application pending·0 cites
- 1154US5750257AInsulated electric wireOPTEC DAI ITCHI DENKO CO LTD·Filed 1996·Granted May 12, 1998·22 cites·12 claims
- 1246US12122867B2Photocurable resin composition and use thereofARISAWA SEISAKUSHO KK·Filed 2019·Granted Oct 22, 2024·0 cites·17 claims
- 1345US2010186998A1Polyamideimide resin for flexible printed circuit boards; metal-clad laminate, coverlay, and flexible printed circuit board that use this resin; and resin compositionARISAWA SEISAKUSHO KK·Filed 2010·Application pending·0 cites
- 1443US2018242448A1Resin composition, adhesive film, coverlay film, laminate, resin-coated copper foil and resin-coated copper-clad laminateARISAWA SEISAKUSHO KK·Filed 2018·Application pending·0 cites
- 1541US10982093B2Low-dielectric resin compositionARISAWA SEISAKUSHO KK·Filed 2016·Granted Apr 20, 2021·0 cites·17 claims
- 1639US2014224529A1Fire-retardant resin composition, metal-clad base laminate for flexible printed circuit board utilizing said composition, cover lay, adhesive sheet for flexible printed circuit board and flexible printed circuit boardDOBASHI SHU·Filed 2012·Application pending·0 cites
- 1738US11609493B2Photosensitive resin composition, solder resist film using said photosensitive resin composition, flexible printed circuit and image display deviceARISAWA SEISAKUSHO KK·Filed 2018·Granted Mar 21, 2023·0 cites·11 claims
- 1837US8426503B2Composition for polyimide resin, and polyimide resin made of the composition for polyimide resinMATSUYAMA HIROYUKI·Filed 2010·Granted Apr 23, 2013·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →