US2010186998A1PendingUtilityA1

Polyamideimide resin for flexible printed circuit boards; metal-clad laminate, coverlay, and flexible printed circuit board that use this resin; and resin composition

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Assignee: ARISAWA SEISAKUSHO KKPriority: Jan 18, 2006Filed: Mar 31, 2010Published: Jul 29, 2010
Est. expiryJan 18, 2026(expired)· nominal 20-yr term from priority
Inventors:Makoto TaiShu Dobashi
B32B 2037/1253C08G 73/14B32B 15/08H05K 1/0346H05K 3/46H05K 2201/0154C08G 73/00B32B 15/088B32B 27/34B32B 2375/00H05K 1/0393B32B 2398/10B32B 2379/08C08G 73/10Y10T428/31681B32B 2309/105B32B 27/281B32B 2307/3065B32B 2309/12B32B 2457/08B32B 2309/04C08L 77/00B32B 15/20B32B 2309/02
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Claims

Abstract

The present invention provides a polyamideimide resin for flexible printed circuit boards that prior to curing exhibits an excellent solubility, processability, and handling characteristics, and that after curing exhibits flame retardancy, solder heat resistance, circuit embeddability, and flexibility and further has a high glass-transition temperature and is able to maintain a high adhesive strength. The present invention provides a polyamideimide resin for flexible printed circuit boards, which is obtained by the polymerization reaction of an acid component comprising at least a monoanhydride and an aromatic dicarboxylic acid with a diisocyanate compound or diamine compound in an approximately equimolar amount with respect to the total molar amount of the acid component, wherein the molar amount of the monoanhydride is 0.4 to 0.8 taking the total molar amount of the acid component as 1.

Claims

exact text as granted — not AI-modified
1 . A polyamideimide resin for flexible printed circuit boards, which is obtained by the polymerization reaction of an acid component comprising at least a monoanhydride and an aromatic dicarboxylic acid with a diisocyanate compound or diamine compound in an approximately equimolar amount with respect to the total molar amount of the acid component, wherein the molar amount of the monoanhydride is 0.4 to 0.8 and the molar amount of the aromatic dicarboxylic acid is 0.2 to 0.6 taking the total molar amount of the acid component as 1. 
   
   
       2 . A metal-clad laminate, in which the polyamideimide resin for flexible printed circuit boards according to  claim 1  is formed as a layer on a metal foil. 
   
   
       3 . A coverlay in which the polyamideimide resin for flexible printed circuit boards according to  claim 1  is formed as a film. 
   
   
       4 . A flexible printed circuit board comprising the coverlay according to  claim 1  disposed on a metal foil that has been formed into a circuit. 
   
   
       5 . A resin composition comprising the polyamideimide resin for flexible printed circuit boards according to  claim 1 .

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