Inventor · disambiguated record
No-Hyun Huh
Also filed as: HUH NO-HYUN
5 granted patents·15 pending applications·29 citations·filing 1998–2010
76Inventor score
Top patents by PatentIndex Score
20 records- 0186US7560712B2Ion implanter with etch prevention member(s)SAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Jul 14, 2009·13 cites·31 claims
- 0276US7497963B2Etching methodSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Mar 3, 2009·7 cites·11 claims
- 0374US8361274B2Etching apparatus and etching methodSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jan 29, 2013·6 cites·12 claims
- 0449US2007087296A1Gas supply device and apparatus for processing a substrateSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 0547US6835276B2Window for allowing end point of etching process to be detected and etching device comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Dec 28, 2004·2 cites·7 claims
- 0644US2008072925A1Wafer cleaning apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 0744US2010319853A1Gas supply device and apparatus for processing a substrateKIM WOO-SEOK·Filed 2010·Application pending·0 cites
- 0844US2008041308A1Substrate treatment apparatus and cleaning methodSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 0942US2008044585A1Methods and apparatus for evaporating liquid precursors and methods of forming a dielectric layer using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 1041US2007087584A1Plasma doping method and plasma doping apparatus for performing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 1141US2007114436A1Filament member, ion source, and ion implantation apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 1240US2007077366A1Plasma doping method and plasma doping apparatus for performing the sameKEUM GYEONG-SU·Filed 2006·Application pending·0 cites
- 1340US2007181062A1Semiconductor device manufacturing apparatus including temperature measuring unitKIM IL-KYOUNG·Filed 2007·Application pending·0 cites
- 1437US2008038930A1Method of ashing an object and apparatus for performing the samePARK JAE-KYUNG·Filed 2007·Application pending·0 cites
- 1536US2011204023A1Multi inductively coupled plasma reactor and method thereofHUH NO-HYUN·Filed 2010·Application pending·0 cites
- 1636US2007051387A1Method of cleaning plasma applicator in situ and plasma applicator employing the sameHWANG WAN-GOO·Filed 2006·Application pending·0 cites
- 1734US2005127192A1Endpoint detector for a substrate manufacturing processFiled 2004·Application pending·0 cites
- 1833US2002088545A1Gas injector comprising block of ceramic material having gas injection holes extending therethrough, and etching apparatus incorporating the sameFiled 2001·Application pending·0 cites
- 1933US2003008419A1Induction magnet for use in producing high-density plasma and method of manufacturing the same, and semiconductor manufacturing equipment comprising the induction magnetFiled 2002·Application pending·0 cites
- 2026US6114237AMethod of forming contacts for a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Sep 5, 2000·1 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →